2011
DOI: 10.1063/1.3525246
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Hydrophobic treatment of organics against glass employing nonequilibrium atmospheric pressure pulsed plasmas with a mixture of CF4 and N2 gases

Abstract: A hydrophobic organics surface selectively against glass was realized by employing nonequilibrium atmospheric-pressure pulsed plasmas with a mixture of CF 4 and N 2 gases. The organic surface was drastically altered to have a high hydrophobicity, while the glass surface itself remained hydrophilic after the plasma treatment with the addition of a small amount of CF 4 to the N 2 gas. After 100 CF 4 / N 2 plasma treatments, no thin film deposition was observed on the organic material. To investigate the characte… Show more

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Cited by 14 publications
(15 citation statements)
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References 33 publications
(27 reference statements)
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“…It could be said that O 2 plasma treatment allowed for homogeneous etching of the RC film contrary to N 2 plasma. After the treatment with CF 4 plasma for 60 s, the surface profile changed to one with broader mounds, and the RMS roughness increased from 14.5 to 24.1 nm, suggesting that the F and/or CF x radicals were generated by the dissociation of CF 4 and deposited on the surface of the RC film (Figures d and d) . This result agrees with the changes in chemical composition, as well as the surface wettability that is previously reported in this work.…”
Section: Resultssupporting
confidence: 90%
“…It could be said that O 2 plasma treatment allowed for homogeneous etching of the RC film contrary to N 2 plasma. After the treatment with CF 4 plasma for 60 s, the surface profile changed to one with broader mounds, and the RMS roughness increased from 14.5 to 24.1 nm, suggesting that the F and/or CF x radicals were generated by the dissociation of CF 4 and deposited on the surface of the RC film (Figures d and d) . This result agrees with the changes in chemical composition, as well as the surface wettability that is previously reported in this work.…”
Section: Resultssupporting
confidence: 90%
“…However, most plasma sources except atmospheric pressure plasma require a vacuum system, which limits rapid multi‐fabrication. For this reason, atmospheric pressure plasma sources have been favored for modification of the surface properties . In atmospheric pressure plasma processing, the plasma conditions such as feed gas flow, power, and source types influence the result of surface treatments because both chemical and physical properties are dictated by the deposition of functional groups and surface morphology, which are affected by the plasma.…”
Section: Introductionmentioning
confidence: 99%
“…It is possible to immediately continue processing the materials, and many studies have been carried out [9]- [12]. Plasma cleaning is aided by the use of gas mixtures containing He, Ar, air, or N 2 with the addition of small amounts of O 2 , H 2 , or CF 4 [13]- [16]. Which addition is used depends on the specific application.…”
Section: Introductionmentioning
confidence: 99%