Hydrophobic coatings using atomic layer deposition and non-chlorinated precursors

Herrmann, Cari F.; DelRio, Frank W.; Bright, Victor M.; George, S.M.

doi:10.1109/mems.2004.1290669

Cited by 5 publications

(2 citation statements)

References 11 publications

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“…To avoid some of the limitations imposed by the chloro-silane chemistry, alkene based monolayers were successfully coated as anti-stiction layers by Ashurst [9], and Herrmann [10] reported the coating of nonchlorinated films by atomic layer deposition.…”

Section: Introductionmentioning

confidence: 99%

Liquid and vapor phase silanes coating for the release of thin film MEMS

Parvais

Pallandre

Jonas

et al. 2005

IEEE Trans. Device Mater. Relib.

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Stiction remains one of the biggest reliability problems in the fabrication of microelectromechanical systems (MEMS). This work investigates the techniques adapted to release thin-film devices (100 nm thick) and submicron gaps MEMS. First, a CMOS compatible wet release process was developed, using nonchlorinated silanes coating providing a high hydrophobicity (contact angle in the range of 110 ). Second, a vapor phase release process based on the same chemistry is shown to be adequate to release thin-film beams from a silicon-on-insulator wafer, where the wet process failed. This is to the authors' knowledge the first time that an in-use stiction-free release process has been demonstrated for such thin structures. The layers resist up to 300 C without damage and X-ray reflectivity confirmed that homogeneous monolayers were obtained.

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Section: Introductionmentioning

confidence: 99%

Liquid and vapor phase silanes coating for the release of thin film MEMS

Parvais

Pallandre

Jonas

et al. 2005

IEEE Trans. Device Mater. Relib.

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“…The reduction of hydrogen bonding can be accomplished by changing the hydrophobic/hydrophilic nature of the surfaces [33], [34].…”

Section: Chemical Bondingmentioning

confidence: 99%

MEMS Reliability Review

Huang

Vasan

Doraiswami

et al. 2012

IEEE Trans. Device Mater. Relib.

158

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Abstract-Microelectromechanical systems (MEMS) represents a technology that integrates miniaturized mechanical and electromechanical components (i.e., sensors and actuators) that are made using microfabrication techniques. MEMS devices have become an essential component in a wide range of applications, ranging from medical and military to consumer electronics. As MEMS technology is implemented in a growing range of areas, the reliability of MEMS devices is a concern. Understanding the failure mechanisms is a prerequisite for quantifying and improving the reliability of MEMS devices. This paper reviews the common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection.

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Microelectromechanical Systems and Packaging

Lee

2009

Materials for Advanced Packaging

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Hydrophobic coatings using atomic layer deposition and non-chlorinated precursors

Cited by 5 publications

References 11 publications

Liquid and vapor phase silanes coating for the release of thin film MEMS

Liquid and vapor phase silanes coating for the release of thin film MEMS

MEMS Reliability Review

Microelectromechanical Systems and Packaging

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