Abstract. Silicon films, typically 1 pm thick are deposited by low pressure chemical vapor deposition using pure silane at 550°C and 3 deposition rates : 13, 23 and 45 h. Using numerous physical, optical and electrical characterization techniques, we show an evident amorphous character of these as-deposited ftlms. Films deposited at high rate correspond more likely to the relaxed amorphous network The quality of the polysllicon produced by annealing these high deposition rate Nms at 600°C is largely enhanced The crystallization time, dehed from the in-situ conductivity measuements at 600°C, is about 4 h for the high deposition rate amorphous film. Such time is very attractive in the attempt to obtain simultaneously cc acceptable n crystallization time and high quality polysilicon. This assertion is emphasized if we consider the total time t of the process (deposition time and crystallization time).