Hydrogen incorporation in tungsten deposits growing by deuterium plasma sputtering

Katayama, Kazunari; Kasahara, Sanshiro; Ishikawa, Shinichiro; Fukada, Satoshi; Nishikawa, Masabumi

doi:10.1016/j.fusengdes.2011.04.032

Cited by 8 publications

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References 6 publications

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“…Deuterium release amount from MD was considerably smaller than hy- drogen release amount although MD was formed by deuterium plasma sputtering. The similar phenomenon for tungsten sputtering-deposition was discussed in the previous paper but the mechanism is not enough clarified yet [12]. It was found that two release peaks of hydrogen isotopes from MD appears at 370 • C and 500 • C. Deuterium release from CD1 has two broad peaks at 600 • C and 800 • C. From CD2, one sharp peak appeared at 800 • C. This suggests that hydrogen isotope retained in carbon deposition is approximately released in the temperature range between 600 • C and 800 • C, depending on deposition condition.…”

Section: Resultssupporting

confidence: 53%

Carbon and Hydrogen Accumulation on Exhaust Duct in LHD

Katayama

Ashikawa

Uehara

et al. 2015

Plasma and Fusion Research

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To consider carbon balance and hydrogen isotope balance in the fuel cycle system and tritium safety management of a fusion reactor, the evaluation of carbon and hydrogen isotope accumulation not only in the vacuum vessel but also in the exhaust system is necessary. In the present work, type 316 stainless steel substrates were installed at 4 locations in the exhaust duct of the Large Helical Device (LHD) during the 13th experimental campaign. By using the combustion method, the amount of carbon slightly adhering to the substrates, which cannot be measured by electric microbalances, was successfully quantified to be 2 µg/cm 2 . The hydrogen release behavior from the substrate was consistent with that from carbon deposition layer formed by hydrogen plasma sputtering. H/C ratio on the substrate was estimated to be about 1-1.5. Hydrogen incorporated into the metal deposit formed from type 316 stainless steel in the sputtering-deposition device in the laboratory can remain in the deposit even under high vacuum condition in the exhaust duct for a long period.

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