2014
DOI: 10.1007/s10854-014-2565-z
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Hydrogen-free synthesis of graphene–graphitic films directly on Si substrate by plasma enhanced chemical vapor deposition

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Cited by 9 publications
(7 citation statements)
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“…As shown, the strongest peak at 284–285 eV is characteristic of C1s, indicating that the major ingredient of NGFs was carbon. The peak of O1s at 529–537 eV with weak intensity was attributed to absorbed oxygen from the atmosphere and the glass substrate [20]. The very tiny peaks of Si2p and Si2s at 96–102 eV and 146–155 eV were attribute to SiO 2 and its related compound from the glass substrate.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…As shown, the strongest peak at 284–285 eV is characteristic of C1s, indicating that the major ingredient of NGFs was carbon. The peak of O1s at 529–537 eV with weak intensity was attributed to absorbed oxygen from the atmosphere and the glass substrate [20]. The very tiny peaks of Si2p and Si2s at 96–102 eV and 146–155 eV were attribute to SiO 2 and its related compound from the glass substrate.…”
Section: Resultsmentioning
confidence: 99%
“…In addition, low-temperature carbon film growth is attractive to reduce the costs and may enable the direct growth of carbon materials on flexible polymer-based substrates. However, the currently typical temperature required for chemical vapor deposition (CVD) growth of carbon-related materials is 800 °C–1000 °C [17,18,19,20], which is still too high. To address these problems, plasma-enhanced chemical vapor deposition (PECVD) was chosen for the preparation.…”
Section: Introductionmentioning
confidence: 99%
“…Chemical vapor deposition (CVD) has emerged as an important method for the preparation and production of graphene since it was first reported in 2008, using Ni and Cu substrates [4],which was followed by an explosion of research activities and publications using a variety of transition metal substrates [17][18][19][20][21][22][23][24]. Among the various synthetic procedures of graphene, Plasma enhanced chemical vapor deposition (PECVD) is a very promising technique due to its peculiar advantages, such as fast growth rate, lower growth temperature, various substrate selection, and better crystallinity.…”
Section: Introductionmentioning
confidence: 99%
“…At first, silicon wafers, glass, copper, copper foil and nickel foil were washed with acetone, alcohol and deionized water three times in five containers respectively. Then, copper, copper foil and nickel foil were soaked in diluted hydrochloric separately, while silicon wafers were washed by RCA process [22]. At last, part of the washed silicon wafers, glass and polished silicon were covered in nickel film by vacuum evaporation.…”
Section: Introductionmentioning
confidence: 99%
“…During such complicated transfer procedures, the introduction of cracks or tears, and contamination of PMMA into graphene films are unavoidable. In this regard, to lower the reaction temperature and avoid the limitations of substrates, plasma-enhanced CVD (PECVD) has been widely used to synthesize transfer-free graphene films on different substrates including both metals and insulators [192][193][194][195][196][197][198][199].…”
Section: Resultsmentioning
confidence: 99%