Hydrogen‐Bonding Integrated Low‐Dimensional Flexible Electronics Beyond the Limitations of van der Waals Contacts
Dexing Liu,
Ziyi Liu,
Xinyu Gao
et al.
Abstract:Van der Waals (vdW) integration enables clean contacts for low‐dimensional electronic devices. The limitation remains, however, that an additional tunneling contact resistance occurs, owing to the inherent vdW gap between the metal and the semiconductor. Here we demonstrate from theoretical calculations that stronger non‐covalent hydrogen‐bonding interactions facilitate electron tunneling and significantly reduce the contact resistance, thus promising to break the limitations of the vdW contact. π‐Plane hydrog… Show more
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