Hydrocarbon Resin-Based Composites with Low Thermal Expansion Coefficient and Dielectric Loss for High-Frequency Copper Clad Laminates

Abstract

The rapid development of the 5G communication technology requires the improvement of the thermal stability and dielectric performance of high-frequency copper clad laminates (CCL). A cyclic olefin copolymer (COC) resin was added to the original 1,2-polybutadienes (PB)/styrene ethylene butylene styrene (SEBS) binary resin system to construct a PB/SEBS/COC ternary polyolefin system with optimized dielectric properties, mechanical properties, and water absorption. Glass fiber cloths (GFCs) and SiO2 were used to fill the resin matrix so to reduce the thermal expansion coefficient (CTE) and enhance the mechanical strength of the composites. It was found that the CTE of polyolefin/GFCs/SiO2 composite laminates decreased with the increase of SiO2 loading at first, which was attributed to the strong interfacial interaction restricting the segmental motion of polymer chains between filler and matrix. It was obvious that the addition of COC and SiO2 had an effect on the porosity, as shown in the SEM graph, which influenced the dielectric loss (Df) of the composites directly. When the weight of SiO2 accounted for 40% of the total mass of the composites, the laminates exhibited the best comprehensive performance. Their CTE and Df were reduced by 63.3% and 22.0%, respectively, and their bending strength increased by 2136.1% compared with that of the substrates without COC and SiO2. These substrates have a great application prospect in the field of hydrocarbon resin-based CCL.

Phosphorus-Containing Flame-Retardant Benzocyclobutylene Composites with High Thermal Stability and Low CTE

“…In these thermosetting resins, during the heating process, the relative movement between molecules is more difficult, which will affect the displacement between polymer molecules and make them not easy to deform. These thermosetting resins have stable properties at higher temperatures, are not easy to deform, and can be processed, which is conducive to the preparation of relevant electronic circuit copper clad plate materials …”

“…At the same time, the CTE between materials and copper foils in CCL is also worth paying attention to. Excessive differences in CTE between the two will lead to interlayer delamination of copper foils during operation at high frequency or power and high temperature, which will deform from the CCL substrate during application. − This will reduce the reliability and service life of CCL and in some cases lead to catastrophic equipment failure. The high CTE of the substrate usually weakens the stability of the CCL through-hole.…”

“…These thermosetting resins have stable properties at higher temperatures, are not easy to deform, and can be processed, which is conducive to the preparation of relevant electronic circuit copper clad plate materials. 19 3.7. Mechanical Properties' Research.…”

A novel epoxy vitrimer with low dielectric constant at high‐frequency

“…In recent years, significant advances have been made in the development of fifth‐generation mobile communication technology (5G), which has lower transmission latency and higher frequency comparing with earlier generations. As the signal transmission speed is inversely proportional to square root of the dielectric constant and the transmission loss is proportional to square root of the dielectric loss, 1 there remains extensive demand for lightweight materials with good dielectric performance at high‐frequency used in electronic devices, such as portable devices, 5G base stations and Radom closures, to reduce weight and achieve efficient stable signal transmission 2–3 . The design and development of low dielectric thermosetting matrix resins which are lightweight, versatile and easy to fabricate have attracted widespread attention.…”

Investigation of TiO2 and SiO2 Filled Polybutadiene Composite Substrates and Their Dielectric Properties

“…Among these resins, Polybutadiene (PB) is a weak-polar polymer [13] with high symmetry structure and contains few types and numbers of polar groups, and benefiting from its advantage of forming dense three-dimensional network structure by initiating crosslinking reaction at low temperature with initiator, [14] PB is one of the best options used as the matrix material for composite substrate. In the previously reported research [13,[15][16][17][18] on inorganic filler filled PB composite substrate, the focus is usually on the mechanical properties or the influence of interface compatibility between ceramics and polymers on the dielectric constant, seldom on the porosity, moisture absorption, even the τ ε . However, the τ ε is an important parameter for substrate application.…”