Abstract:Stacking die technology using through-silicon-via (TSV) technology has attracted a lot of attention due to various advantages in performance and integration. However, a high temperature environment during the fabrication process of TSV leads to uncontrollable thermal expansion, which then causes a serious reliability problem, the thermal mechanical problem. This problem can result in deformation or mechanical damage to the dies; therefore, it must be resolved. Unlike previous works applying novel components wh… Show more
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