Hybrid Substrates for Power Electronic Applications: An Investigation of Thermal Resistance and Mechanical Stress

Abstract

A new hybrid substrate technology for power electronic applications has been characterised by thermal resistance and mechanical stress measurements. The new substrate utilises thermal spray technology for deposition of dielectric layer and electrical conductors. The results are compared with the more established technology of alumina substrates with direct copper bonding (DCB) metallisation. Silicon test chips for thermal resistance and mechanical stress measurement were used for the characterisation. The experimental results were compared with finite element analysis and a reasonable agreement was found.