2003
DOI: 10.1109/tnano.2003.820817
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Hybrid silicon nanocrystal silicon nitride dynamic random access memory

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Cited by 29 publications
(20 citation statements)
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“…Recently it started to attract attention both as a host embedding material for nanocrystals 10,11,12 and also for optical waveguide applications 2 . The α-and β-Si 3 N 4 have hexagonal conventional cells with four and two molecules, respectively.…”
Section: Si3n4 and Ge3n4mentioning
confidence: 99%
See 1 more Smart Citation
“…Recently it started to attract attention both as a host embedding material for nanocrystals 10,11,12 and also for optical waveguide applications 2 . The α-and β-Si 3 N 4 have hexagonal conventional cells with four and two molecules, respectively.…”
Section: Si3n4 and Ge3n4mentioning
confidence: 99%
“…These nanocrystals are embedded in an insulating matrix which is usually chosen to be silica 4,5,6,7 . However, other wide bandgap materials are also employed such as germania 8,9 , silicon nitride 10,11,12 , and alumina 13,14,15 . As a matter of fact, the effect of different host matrices is an active research topic in this field.…”
Section: Introductionmentioning
confidence: 99%
“…This technique has been performed widely for the fabrication of NVM device. 2) Considering the nature of the true thickness, epitaxial orientation relationships and morphology of each layer, one can examine the sample through tilting the orientation to an exact zone of silicon substrate from cross-sectional observation. The plane-view examination can provide the information of particle size, density and morphology as well.…”
Section: Introductionmentioning
confidence: 99%
“…The result indicates a superior tolerance against the conventional Flash memory, which typically allows not more than 10 5 programming/erasing cycles due to the tunneling oxide degradation by the hot carrier effect. A high endurance was also reported based on silicon-nitride/nc-Si memory structure recently [71]. …”
Section: Operation Speed and Device Reliabilitymentioning
confidence: 83%
“…Alternatively, to improve charge retention time with consuming programming/ erasing time, one may take advantages of trap-assisted charging/discharging that needs the thermal excitation process [71]. Horv ath fabricated a Si 3 N 4 /nc-Si/Si 3 N 4 capacitor memory, which gave rise to a huge memory window with charge storage in the upper Si 3 N 4 film.…”
Section: Characteristics Improvements Of the Nc-si Flash Memorymentioning
confidence: 99%