Encyclopedia of Imaging Science and Technology 2002
DOI: 10.1002/0471443395.img115
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Hybrid Semiconductor Pixel Detectors for Low‐ and Medium‐EnergyX‐ and Gamma‐Ray Single Photon Imaging Using the Medipix Read‐Out Chip

Abstract: After a brief description of microstrip and pixel detectors for radiation imaging with X‐rays and gamma‐rays, the functionality, physical response, and imaging performance of the hybrid pixel detectors based on the Medipix1 photon counting chip for such diverse imaging applications such as digital mammography, synchrotron X‐ray radiation, nuclear medicine, and so on are described. It is concluded that such hybrid pixel detectors, originated from high‐energy physics, have great potential for specific scientific… Show more

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Cited by 16 publications
(9 citation statements)
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“…Using the flip-chip technology, the readout chip is connected pixel by pixel via bump-bonding to a matching pixel detector to form a so-called hybrid detector. [2] This configuration has the advantage of optimizing separately the microelectronics technology (reduced pixel pitch, increased density of transistors per cell) implemented in the low resistivity silicon substrate of the ASIC, and the room temperature semiconductor pixel detector, implemented using material substrates like high-resistivity silicon, bulk or epitaxial GaAs, CdTe, and CdZnTe. Different semiconductors (elemental or compound), as well as different substrate thicknesses, can then be selected in order to cope with different application needs.…”
mentioning
confidence: 99%
“…Using the flip-chip technology, the readout chip is connected pixel by pixel via bump-bonding to a matching pixel detector to form a so-called hybrid detector. [2] This configuration has the advantage of optimizing separately the microelectronics technology (reduced pixel pitch, increased density of transistors per cell) implemented in the low resistivity silicon substrate of the ASIC, and the room temperature semiconductor pixel detector, implemented using material substrates like high-resistivity silicon, bulk or epitaxial GaAs, CdTe, and CdZnTe. Different semiconductors (elemental or compound), as well as different substrate thicknesses, can then be selected in order to cope with different application needs.…”
mentioning
confidence: 99%
“…For the Tc-99m (140 keV) gamma radiation detector we plan to use a 1 mm-thick CdTe pixel detector readout via the Medipix2 CMOS circuit [9] (256 256 pixels with 55 m pitch), a hybrid detector [10] used in single photon counting system; the Medipix2 ASIC will be interfaced serially via a MUROS2 board [11] or in parallel mode via a MPRS board [12] to a PC, running the Medisoft 4 software [13]. In the present prototype, however, we use the available first version of the chip (Medipix1) [14], which has 64 64 pixels with 170 m pitch (11 11 mm sensitive area), bump-bonded to a 300 m thick silicon detector.…”
Section: A Radionuclide Imagingmentioning
confidence: 99%
“…Medipix series chip adds significant improvements to the previous Medipix1 version (1.0 µm CMOS, 64x64 pixel, 170 µm pitch, single charge polarity and single detection threshold, 15 bit counter), which has shown applications in all fields mentioned above [8]. Matrix [2,7] The Medipix2 chip is a complex Application Specific Integrated Circuit (ASIC) of about 2 cm 2 sensitive area which contains around 33 million transistors, with operative voltage levels set digitally via internal DACs and with both a serial and a parallel I/O bus.…”
Section: The Medipix2 Chip and Its Read-out Interfacesmentioning
confidence: 99%