Hybrid polymer/silica vertical coupler switch with &lt; –32 dB polarisation-independent crosstalk

Keil, Norbert; Yao, H.H.; Zawadzki, C.; Lösch, K.; Satzke, K.; Wischmann, Wiltraud; Wirth, J.v.; Schneider, J.; Bauer, J.; Bauer, Monika

doi:10.1049/el:20010073

Cited by 18 publications

(5 citation statements)

References 3 publications

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“…3.4(a)). This 3D optical switch allows a crosstalk of about -13 dB for a power consumption of about 800 mW and a switching time of about 7 ms. Keil et al (2001) reported a thermo-optical vertical coupler switch, in which the lower waveguide is made of SiO 2 whereas the upper one is made of polymer. Thus, this structure requires the combination of two technologies -the SiO 2 technology for the lower waveguide and the polymer technology for the upper waveguide.…”

Section: Adiabatic Mode Couplermentioning

confidence: 99%

“…Kim et al (2004) Vertical coupler 800 7 ms 213 Keil et al (2001) Vertical coupler <80 -232 (polymer/silica) Chen et al (2005) Vertical coupler 50 2 ms 223 (polymer) J. Michelson 100 35 µs -interferometer (SOI) Gu et al (2007) Photonic crystal 78 20 µs -(SOI) Kiyat et al (2006) Racetrack 17 4.8 µs -resonator (SOI) Pruessner et al (2007) Fabry-Perot 10 640 ns -cavity (SOI) Zhu et al (2008) Optical well 3.8…”

Section: Input Wavefront Ribmentioning

confidence: 99%

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Thermo-optical switches

et al. 2010

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Section: Adiabatic Mode Couplermentioning

confidence: 99%

Section: Input Wavefront Ribmentioning

confidence: 99%

Thermo-optical switches

et al. 2010

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“…Optoelectronic devices have to fit within these process tolerances. The institute is also developing a hybrid polymer-silica vertical coupler switch in which silica waveguides are used for low loss transport and the polymer, having a much higher thermal-optic coefficient, is used to affect the coupling and thermal switching [15], [16]. Similarly, NTT has developed chip-to-chip optical communication using surface mount technology and waveguides embedded in a printed wiring board [17].…”

Section: Global R and D Developments In Optoelectronicsmentioning

confidence: 99%

Chip-to-Chip Optoelectronics SOP on Organic Boards or Packages

Chang

Guidotti

Liu

et al. 2004

IEEE Trans. Adv. Packag.

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In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.Index Terms-optical interconnections, optical planar waveguides.

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“…A number of researchers and companies worldwide have been active in pursuing the investigation and development of polymer-based switches. [1][2][3][4][5][6][7][8][9][10][11][12][13] Recent improvements in the performance of the polymers used in the construction of such switches 14 has now led to a significant further advance in the performance of polymer-based thermo-optic switches, as is described herein.…”

Section: Introductionmentioning

confidence: 99%

High performance thermo-optic switches based on low-loss acrylate polymers

et al. 2003

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We design and fabricate digital thermo-optic switches using low-loss photocuring fluoroacrylate polymers. We use both modeling and experimental design-rule studies to elucidate the contributions to loss and cross talk of the various important building blocks that comprise a Y-branch digital optical switch (YDOS). We present the results of these studies as well as the achieved performance for 1ϫ2, 2ϫ2, and 4ϫ4 switches fabricated with these designs. Average fiber-to-fiber chip-level insertion loss (IL) values for the three designs are 1.1, 1.5, and 2.8 dB, respectively, for 1550-nm illumination. Switching times in every case are below 3 ms. Polarization-dependent loss is less than 0.1 dB at 1550 nm. Fully packaged permanently pigtailed versions of the 2ϫ2 and 4ϫ4 switches are also constructed. For these packaged devices, average insertion losses of 2.0 and 3.3 dB are achieved, and cross talk is maintained at a value less than Ϫ45 dB. Recent advances in materials performance have now allowed the insertion loss performance to be further improved, with chip-level IL being reduced to 1.0 and 2.2 dB for 2ϫ2 and 4ϫ4 switches, respectively.

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Hybrid polymer/silica vertical coupler switch with < –32 dB polarisation-independent crosstalk

Cited by 18 publications

References 3 publications

Thermo-optical switches

Thermo-optical switches

Chip-to-Chip Optoelectronics SOP on Organic Boards or Packages

High performance thermo-optic switches based on low-loss acrylate polymers

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