Hybrid optical packaging, challenges and opportunities

Dautartas, M.F.; Fisher, J.E.; Hui, Luo; Datta, Proyag; Jeantilus, A.

doi:10.1109/ectc.2002.1008189

Cited by 12 publications

(5 citation statements)

References 2 publications

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“…After cleaving, the fiber has a portion of outer jacket portion is stripped off since the fabrication tolerance of the fiber jacket is low and will lead to a poor alignment result [2]. The fiber is placed onto the V-groove after cleaning with isopropanol.…”

Section: Flow Control In Modified Passive Alignmentmentioning

confidence: 99%

“…Active alignment offers a high alignment yield (coupling efficiency) but it is a time-consuming and costly process. Passive alignment is one of the options for low cost and high throughput fiber alignment [2]. Nowadays the silicon optical bench (SiOB) is widely used to integrate different optical components such as laser source, photo detector and waveguide [3].…”

Section: Introductionmentioning

confidence: 99%

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Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers

Lam

Lee

2008

2008 2nd Electronics Systemintegration Technology Conference

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In this paper, a stopper mechanism is introduced to control the length of the epoxy flow in the V-grooves. In fact, such a stopper is another V-groove which is perpendicular to the V-grooves for passive fiber alignment. During the fabrication of prototypes, one critical issue was identified. Due to the undercutting of wet etching, the right angles at the intersection of the stopper and alignment V-grooves were severely eroded by the etching solution. Consequently the intended "cross" intersection became a diamond shaped area. As a result, the length of epoxy flow could not be precisely controlled. During the course of the present study, a convex comer compensation scheme was implemented to resolve the undercutting problem. A parametric study was performed with various kinds of redundant silicon beam patterns at the comers of the intersection. Experimental results showed that relatively sharp comers could be achieved with certain compensation patterns. Furthermore, the epoxy flow did indeed stop when the flow hit the intersection of the stopper and the V-grooves. The design and processing parameters for the epoxy flow stopper and the convex comer compensation scheme will be discussed in detail in this paper.

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Section: Flow Control In Modified Passive Alignmentmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers

Lam

Lee

2008

2008 2nd Electronics Systemintegration Technology Conference

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“…In fact, some current microphotonisc device packaging is akin to 'building a ship in a bottle' 4 . Currently the huge portion of cost is involved for the packaging and testing of these devices 5 . For example, in a study of cost breakdown for MEMS / MOEMS, it was determined that 10 -25% of the costs were borne by material, 15 -20% by measurement and testing, and whopping 55 -85% by packaging, interconnects and microassemblies 6,7 .…”

Section: Challenges In Microsystems Packagingmentioning

confidence: 99%

Numerical prediction of radiation heat transfer in optoelectronics hermetic packaging process

Saha

Liu

2005

SPIE Proceedings

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Hermetic packaging of the high-speed optoelectronics devices is important not only for robustness but also to protect the device from adverse operational environments and ensure reliable communications. We have developed a complete hermetic packaging assembly process for a photonic Mini-DIL module of 10.0Gbps type. We have developed and simulated the step by step fluxless reflow soldering process (pick and place) of the whole mini-module package and finally, the hermetic sealing by Finite Element Analysis (FEA) simulation. A commercially available, general purpose, finite element program -ABAQUS ® has been used along with Altair HyperWorks ® as pre and post processor for this numerical simulation. The actual 3-D model has been simplified to the 2-D model for the hermetic sealing, radiation heat transfer prediction to reduce computational complicacy. During the sealing process at a high temperature, there is a possibility of considerable heat transfer from the module top sealing cap to the high temperature susceptible LD (Laser Diode). In the event of a critical temperature the LD may suffer malfunction and eventual destruction. Radiation along with the conduction heat transfer mechanism has been modeled for this sealing to predict the temperature variation as a result of heat transfer from wledspots to the LD. Various issues with cavity radiations such as, effect of radiation view factor, surface blocking and surface emissivity have been considered and results discussed. The convection mechanism has been neglected considering the hermeticity of the sealing.

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“…A slight offset in any direction will degrade the performance of photonic devices or assemblies [1][2]. The tolerance of fiber alignment is very tight, particularly for single-mode fibers in which the core diameter is only 9 μm [3].…”

Section: Introductionmentioning

confidence: 99%

Effect of V-groove Side Wall Feature on Epoxy Flow in Passive Alignment of Optical Fiber

Lam

Lee

2007

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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The alignment issue with optical fibers is very important in optoelectronics packaging. A slight offset in any direction could severely affect the optical performance of photonic devices. Nowadays passive alignment of optical fiber has become popular due to its low cost and short processing time. The self-alignment property is another advantage of passive alignment.A recent study states that the dispensing volume and the viscosity are the main factors affecting the yield of passive alignment. On the other hand, the surface feature of the V-groove side wall is another significant factor affecting the fiber alignment. In order to get an optimum surface condition for the V-groove, alignment of the mask pattern to the [1 1 0] direction is very important. Slight misalignment between the mask and crystal direction will change the surface profile of the wall, as well as the dimension of the V-groove, and hence affect the alignment of the fiber.In this paper, the effect of mask misalignment and the side wall feature on fiber alignment is studied. V-grooves with no rotation, rotated 1 o , 2 o and 3 o are fabricated by anisotropic etching. Surface profiles are characterized by using an optical profiler. It can be shown that angular misalignment between the pattern and the crystal direction will result in a poor surface profile. An epoxy flow study is carried out to measure the effect of the side wall feature. Experimental results show poor surface profile will reduce the yield of optical fiber passive alignment. The result is useful in optimizing the V-groove fabrication process and the epoxy flow in the passive alignment of optical fiber.

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Hybrid optical packaging, challenges and opportunities

Cited by 12 publications

References 2 publications

Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers

Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers

Numerical prediction of radiation heat transfer in optoelectronics hermetic packaging process

Effect of V-groove Side Wall Feature on Epoxy Flow in Passive Alignment of Optical Fiber

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