Hybrid nanomaterial inks for printed resistive temperature sensors with tunable properties to maximize sensitivity

Tursunniyaz, Muhammadeziz; Agarwal, Vasvi; Meredith, Anna; Andrews, Joseph B.

doi:10.1039/d2nr04005k

Cited by 7 publications

(5 citation statements)

References 36 publications

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“…In particular, it is promising to formulate a conductive hybrid ink which utilizes multiple nanomaterials in its formulation. In a recent example, a hybridized ink comprising of silver, copper, and nickel nanoparticles had the potential to increase the overall sensitivity of the printed temperature sensor by 300% [380]. Formulation of a hybrid ink will involve careful consideration of the compatible metallic nanoparticles, compatible solvent/additives with different nanoparticles, and a suitable printing method.…”

Section: Advances In Science and Technology To Meet Challengesmentioning

confidence: 99%

Roadmap on printable electronic materials for next-generation sensors

Pecunia,

Petti,

Andrews

et al. 2024

Nano Futures

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The dissemination of sensors is key to realizing a sustainable, ‘intelligent’ world, where everyday objects and environments are equipped with sensing capabilities to advance the sustainability and quality of our lives—e.g., via smart homes, smart cities, smart healthcare, smart logistics, Industry 4.0, and precision agriculture. The realization of the full potential of these applications critically depends on the availability of easy-to-make, low-cost sensor technologies. Sensors based on printable electronic materials offer the ideal platform: they can be fabricated through simple methods (e.g., printing and coating) and are compatible with high-throughput roll-to-roll processing. Moreover, printable electronic materials often allow the fabrication of sensors on flexible/stretchable/biodegradable substrates, thereby enabling the deployment of sensors in unconventional settings. Fulfilling the promise of printable electronic materials for sensing will require materials and device innovations to enhance their ability to transduce external stimuli—light, ionizing radiation, pressure, strain, force, temperature, gas, vapours, humidity, and other chemical and biological analytes. This Roadmap brings together the viewpoints of experts in various printable sensing materials—and devices thereof—to provide insights into the status and outlook of the field. Alongside recent materials and device innovations, the roadmap discusses the key outstanding challenges pertaining to each printable sensing technology. Finally, the Roadmap points to promising directions to overcome these challenges and thus enable ubiquitous sensing for a sustainable, ‘intelligent’ world.

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Section: Advances In Science and Technology To Meet Challengesmentioning

confidence: 99%

Roadmap on printable electronic materials for next-generation sensors

Pecunia,

Petti,

Andrews

et al. 2024

Nano Futures

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“…Recently, printed W has been used as solar absorber coatings [ 159 ] and radiation shielding on circuit boards ( Figure 3 a) [ 160 ]. In contrast, printed Cu has been utilized in various applications such as Cu grid electrodes for organic light-emitting diodes (OLEDs) ( Figure 3 b) [ 161 ], porous 3D scaffold for Li-ion batteries [ 56 ], current collecting grids for photovoltaics [ 162 ], repairing PCB boards [ 163 ], interconnects and power electronics [ 164 , 165 , 166 ], resistive temperature sensors [ 167 ]. The following section discusses the progress and challenges of printing Cu and W for these applications.…”

Section: Cu and W Printingmentioning

confidence: 99%

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Doddapaneni,

Lee,

Aysal

et al. 2023

Nanomaterials

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Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.

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“…Three sensing methods are the most commonly used in this context: Thermistors, [27,28] thermocouples, [29,30] and resistance temperature detectors (RTDs). [31,32] Generally, these represent the primary technologies for digital temperature measurements. [33] In the recent work, we could demonstrate the fabrication and performance of fully printed temperature sensor arrays on plastic foils.…”

Section: Introductionmentioning

confidence: 99%

Integrated CPU Monitoring Using 2D Temperature Sensor Arrays Directly Printed on Heat Sinks

Huber,

Belles,

Bücher

et al. 2024

Adv Materials Technologies

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In today's digital world, the demand for computer security and system reliability is a crucial element. Monitoring the CPU temperature during operation provides valuable insights but is currently limited to the embedded on‐chip sensors. The implementation of an extra security layer based on temperature monitoring can detect anomalies in an early stage, identify malware, and help mitigate attacks. The approach of integrating more on‐chip temperature sensors into the silicon is avoided due to space, power limitations, and cost constraints. However, the field of printed electronics and sensor technology has recently seen significant progress. This is the first work that introduces a fully‐printed temperature sensor array integrated onto the cooling unit of a CPU. It offers a novel approach for the practical implementation of such sensors into an operational computer system. The present sensor array, consisting of 396 sensor pixels, detects local hotspots induced by the underneath CPU cores, leading to an individual thermal fingerprint. This unique method paves the way for addressing pivotal elements of computer security, as deviations from expected thermal behavior can signal malicious activities. Additionally, this innovation facilitates reliability optimization. The detailed thermal map garnered provides insights into which cores are subjected to significant stress over time.

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Hybrid nanomaterial inks for printed resistive temperature sensors with tunable properties to maximize sensitivity

Abstract: Nanomaterial-based inks are one of the essential building blocks for printed electronics. Inks consisting of silver nanoparticles have been well received as conductive ink for printed electronics among researchers and...

Cited by 7 publications

References 36 publications

Roadmap on printable electronic materials for next-generation sensors

Roadmap on printable electronic materials for next-generation sensors

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Integrated CPU Monitoring Using 2D Temperature Sensor Arrays Directly Printed on Heat Sinks

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