Hybrid integration of optical and electronic components on a silicon motherboard

Jones, C.A.; Cooper, Ken B.; Nield, M.W.; Rush, J. D.; Collins, J.V.; Hall, I.P.; McDonna, A.P.; Brown, Stacy

doi:10.1109/leos.1994.586538

Cited by 2 publications

(2 citation statements)

References 4 publications

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“…The feasibility of using microreplication technology in a microelectromechanical system (MEMS) was demonstrated by fabricating a prototype polymeric motherboard for an optical receiver module. Similar motherboard designs have been realized in silicon [5][6][7].…”

Section: Demonstration Of An Optical Receivermentioning

confidence: 93%

Polymeric MST - high precision at low cost

Elderstig¹,

Larsson²

1997

J. Micromech. Microeng.

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A low-cost production process for fabrication of polymeric microstructures from micromachined silicon is demonstrated in a splice for the splicing of optical fibers and an optical motherboard. Measurements on splices showed less than 0.5 dB insertion losses. The prototype polymeric motherboard concisted of an optical receiver module. The detector that was mounted on the polymeric optical motherboard detected about 70% of the transferred light. Measurements with modulated light indicates an optical bandwidth of 5 GHz at 2 V reverse current on the pin-diode.

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Section: Demonstration Of An Optical Receivermentioning

confidence: 93%

Polymeric MST - high precision at low cost

Elderstig¹,

Larsson²

1997

J. Micromech. Microeng.

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“…Silicon is expected to play the central role also in the near future, mainly due to the fact that many investments have been put into silicon manufacturing plants all over the world and they are not likely to change manufacturing techniques soon. Therefore, much interest is shown at the moment in joining different materials with silicon to enable hybrid systems by integrating micromechanical, as well as micro opto, devices onto silicon 'motherboards' [5,6].…”

Section: The Role Of Siliconmentioning

confidence: 99%

Micromechanics in optical microsystems - with focus on telecom systems

Bäcklund¹

1997

J. Micromech. Microeng.

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As micromachining in semiconductor materials is known to be precise with micrometre or even submicrometre dimension control, it is well suited for building optical microsystems. In this paper the potentials for microstructure technologies (MSTs) are presented, with focus on optical telecommunication systems. The specific parts and requirements for telecom systems are presented, as well as areas where future MST can be advantageous to use. Our own work at Uppsala University in this field is also presented. It has mainly been focused on how to use MST for passive alignment when building hybrid micro optical systems.

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Hybrid integration of optical and electronic components on a silicon motherboard

Cited by 2 publications

References 4 publications

Polymeric MST - high precision at low cost

Polymeric MST - high precision at low cost

Micromechanics in optical microsystems - with focus on telecom systems

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