Hybrid Filler with Nanoparticles Grown in Situ on the Surface for the Modification of Thermal Conductive and Insulating Silicone Rubber

Abstract

Insulating materials with high thermal conductivity have become the key to solving the internal heat problem of electronic components. In this study, two fillers were prepared by the in situ generation method. The uniform distribution of silicon dioxide (SiO2) nanoparticles and silver (Ag) nanoparticles on the surface of graphene oxide (GO) and silicon carbide (SiC) was proved by characterization methods such as micromorphology (TEM and SEM) and elemental analysis (XPS), respectively. The fillers above prepared were then added to silicone rubber (SR) to improve its thermal conductivity. SiO2 nanoparticles attached to the GO surface were compatible with the SR matrix, so the thermal resistance of the interface between the GO and the matrix was reduced. The thermal conductivity of Ag nanoparticles generated on the SiC surface was significantly better than that of SiC whiskers. Besides, the composite filler was more conducive to the formation of a heat conduction path, so the thermal conductivity of silicone rubber was improved. In addition, the composite SR maintained pleasing electrical insulating properties, and the volume resistivity of all samples was above 1013 Ω·cm. The prepared composite filler and composite SR provide ideas for developing high-performance thermally conductive and insulating polymers.

Nanocarbon‐Based Hybrid Fillers in Thermally Conductive Polymer Composites: A Review

“…However, it is burdened by the drawbacks of being heavy and expensive. Ceramic materials, including boron nitride (BN), [3] aluminum nitride (AlN), [13,14] silicon carbide (SiC), [15,16] silicon dioxide, [17] aluminum oxide (Al 2 O 3 ), [18,19] zirconium boride, [20] etc., exhibit lower TC compared to metal and nanocarbon fillers. However, they typically possess low electrical conductivity, making them particularly well-suited for composites that require high thermal conduction and electrical insulation.…”

Molecular Dynamics Simulation on the Heat Transfer in the Cross-Linked Poly(dimethylsiloxane)

“…Poly­(dimethylsiloxane) (PDMS) is an ideal polymer matrix for the thermal interface material due to its excellent electrical insulation, chemical stability, compressibility, and flexibility. Therefore, it has a wide application in electronic equipment and aerospace. − However, the thermal conductivity of PDMS is relatively low (0.15 W/(m·K)) due to phonon scattering, which limits its usage. Adding inorganic fillers (e.g., boron nitride, graphene, and carbon nanotubes) into the matrix is an effective method to enhance the thermal conductivity.…”

Interlayer growth of SiC nanowires in graphene aerogel for thermal conductivity enhancement of epoxy resin and its mechanism

“…[24][25][26][27][28][29] SiC is a material with high thermal conductivity ($300 W/mK 30 ), and one-dimensional SiC NWs play an important role in the research of a large number of thermal conductive composites due to their ultra-high aspect ratios. [31][32][33] Song et al 32 used silicon carbide nanowires, reduced graphene oxide, and cellulose nanofibers as assembly units to construct vertically arranged filling networks using an ice template assembly strategy. SiC/RGO/ silicone rubber composites were prepared by infiltrating the with silicone rubber, the composite material filled with 1.84 vol% filler network has a thermal conductivity of 2.74 W/mK.…”

“…In polymer matrices, the synergistic effect between fillers of different shapes and sizes can be utilized to further optimize the thermal conductive network, thereby achieving the goal of preparing composites with better thermal conductivity 24–29 . SiC is a material with high thermal conductivity (~300 W/mK 30 ), and one‐dimensional SiC NWs play an important role in the research of a large number of thermal conductive composites due to their ultra‐high aspect ratios 31–33 . Song et al 32 used silicon carbide nanowires, reduced graphene oxide, and cellulose nanofibers as assembly units to construct vertically arranged filling networks using an ice template assembly strategy.…”