Hybrid dual-color MWIR detector for airborne missile warning systems

Hirsh, I.; Shkedy, Lior; Chen, D.; Fishler, N.; Hagbi, Y.; Koifman, A. I.; Openhaim, Yaki; Vaserman, I.; Singer, Michael J.; Shtrichman, I.

doi:10.1117/12.919462

Cited by 10 publications

(9 citation statements)

References 10 publications

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“…Finally, third generation systems were introduced which have a larger number of pixels, higher frame rates, better thermal resolution, multicolor functionality and other on-chip functions [3]. Raytheon [20], SCD [21], AIM [22], Sofradir [23] [26]. Figure 6 shows flip-chip bonding technique for the integration of detector and ROIC.…”

Section: Infrared Imaging Systemsmentioning

confidence: 99%

Digital readout integrated circuit (DROIC) implementing time delay and integration (TDI) for scanning type infrared focal plane arrays (IRFPAs)

Ceylan

Shafique

Burak

et al. 2016

Infrared Physics & Technology

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Section: Infrared Imaging Systemsmentioning

confidence: 99%

Digital readout integrated circuit (DROIC) implementing time delay and integration (TDI) for scanning type infrared focal plane arrays (IRFPAs)

Ceylan

Shafique

Burak

et al. 2016

Infrared Physics & Technology

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“…InSb detector arrays have found many applications in MWIR due to their spatial uniformity, low dark current and image quality. This technology has evolved over the years in response to the stringent requirements for applications in missile seekers and missile warning systems (MWS) [57][58]. For these applications, the IR imagers need to exhibit high dynamic range, fast frame rates, high resolution, very wide fields of view (FOV), and high sensitivity.…”

Section: Insb Detector Arraymentioning

confidence: 99%

“…One band detects the target while the other band subtracts the background for noise suppression. The actual wavelength bands in 3-5 micron range vary from application to application [58]. Figure 13 presents the transmission of the integrated InSb sensor with cold filters for the two MWIR bands that are commonly referred to as the blue band (shorter wavelength) and the red band with the longer spectral response.…”

Section: Insb Detector Arraymentioning

confidence: 99%

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Advances in Infrared Detector Array Technology

Dhar¹,

Dat²,

Sood³

2013

Optoelectronics - Advanced Materials and Devices

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This Chapter covers recent advances in Short Wavelength Infrared (SWIR), Medium Wavelength Infrared (MWIR) and Long Wavelength Infrared (LWIR) materials and device technologies for a variety of defense and commercial applications. Infrared technology is critical for military and security applications, as well as increasingly being used in many commercial products such as medical diagnostics, drivers' enhanced vision, machine vision and a multitude of other applications, including consumer products. The key enablers of such infrared products are the detector materials and designs used to fabricate focal plane arrays (FPAs). Since the 1950s, there has been considerable progress towards the materials development and device design innovations. In particular, significant advances have been made during the past decade in the band-gap engineering of various compound semiconductors that has led to new and emerging detector architectures. Advances in optoelectronics related materials science, such as metamaterials and nanostructures, have opened doors for new approaches to apply device design methodologies, which are expected to offer enhanced performance and low cost products in a wide range of applications. This chapter reviews advancements in the mainstream detector technologies and presents different device architectures and discussions. The chapter introduces the basics of infrared detection physics and various infrared wavelength band characteristics. The subject is divided into individual infrared atmospheric transmission windows to address related materials, detector design and device performance. Advances in pixel scaling, junction formation, materials growth, and processing technologies are discussed. We discuss the SWIR band (1-3 microns) and address some of the recent advances in In-GaAs, SiGe and HgCdTe based technologies and their applications. We also discuss MWIR band that covers 3-5 microns, and its applications. Some of the key work discussed includes InSb, HgCdTe, and III-V based Strained Layer Super Lattice (SLS) and barrier detector tech

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Real-time dynamic optimized band detection method for hypersonic glide vehicle

et al. 2022

Infrared Physics & Technology

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Hybrid dual-color MWIR detector for airborne missile warning systems

Cited by 10 publications

References 10 publications

Digital readout integrated circuit (DROIC) implementing time delay and integration (TDI) for scanning type infrared focal plane arrays (IRFPAs)

Digital readout integrated circuit (DROIC) implementing time delay and integration (TDI) for scanning type infrared focal plane arrays (IRFPAs)

Advances in Infrared Detector Array Technology

Real-time dynamic optimized band detection method for hypersonic glide vehicle

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