2021 IEEE 71st Electronic Components and Technology Conference (ECTC) 2021
DOI: 10.1109/ectc32696.2021.00079
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Hybrid Bonding of Nanotwinned Copper/organic Dielectrics with Low Thermal Budget

Kai-Cheng Shie
1
,
Pin-Syuan He
2
,
Yu-Hao Kuo
3
et al.
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Cited by 10 publications
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