Hybrid Approach with Parallel Algorithm for Simulation of Natural Convection in Nanofluid filled inside Wavy Square Enclosure with Varying Undulations

Abstract

Purpose- The current paper is aimed to study the numerical simulation of natural convection in water based nanofluid containing Cu-nanoparticles filled inside a wavy square enclosure with varying undulations by implementing hybrid EFGM/FEM with parallel algorithm. Design/methodology/approach- The flow is steady, laminar and incompressible with single phase model of nanofluid. The enclosure is wavy in nature with sinusoidal formulation having fixed amplitude (A=0.15) while the number of undulations is varied. A uniform magnetic field of strength B0 is applied at an inclination angle γ. The effect of various parameters; Rayleigh number (Ra), Hartmann number (Ha), number of undulations (n) and magnetic field inclination angle (γ) on rate of heat transfer has been analyzed. Hybrid EFGM/FEM approach is implemented. Findings- Simulation is done for the average Nusselt number calculated at the cold wavy surface, streamlines and isotherms. In order to enhance the computational efficiency, hybrid EFGM/FEM approach with parallel algorithm is implemented. It is observed that the computational time for the hybrid EFGM/FEM is less as compared to that for the element free Galerkin technique. Moreover, on increasing the number of undulations upto 4, the rate of heat transfer increases through the cavity while the number of undulations above 4 results in decreased rate of heat transfer. Originality/value- The implementation of meshfree methods has wide range of applications in phase transition problems, fracture mechanics, plate bending and moving phase boundaries etc. The parallelization of the hybrid scheme has improved the computational efficiency which is a significant novelty of the paper and is not found in the existing literature for such problems. Moreover, another novelty of the paper is the undulated geometry which has many applications in solar panels, electronic chips, generative heat exchangers etc. for controlling the heat transfer rate.