HV submodule technology based on press pack IGBT for largest scale VSC-HVDC application

Bordignon, P.; Zhang, Haitao; Shi, Wei; Serbia, N.; Coffetti, A.

doi:10.1049/cp.2016.0397

Cited by 13 publications

(8 citation statements)

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“…Therefore, the thyristor is fired to take over the surge currents and protect the diodes during a dc-link short circuit. It is important to remark that the selected thyristor is a high-voltage device, which must present a current rating compatible with the surge currents and forward voltage drop much lower than the diodes [25]. In addition, the selected thyristor must withstand high dv/dt even during normal operation [26].…”

Section: Semiconductor Technology and Bypassmentioning

confidence: 99%

On Converter Fault Tolerance in MMC-HVDC Systems: A Comprehensive Survey

Farias

Cupertino

Pereira

et al. 2021

IEEE J. Emerg. Sel. Topics Power Electron.

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Since they were first proposed, modular multilevel converters have been strongly studied in literature. Due to their high component count, some concerns regarding their reliability arise, and several fault-tolerance schemes have been proposed in recent years. This paper presents a comprehensive survey on the converter fault-tolerance strategies for MMC-HVDC systems based on the available technical literature. Some MMC-HVDC solutions adopted in industry are reviewed. This work proposes analytical expressions to determine the maximum number of submodule failures in the MMC-HVDC system. Thereafter, the limitations of the main converter fault-tolerance schemes under submodule failures are described and critically compared. A case study is conducted based on 1000 MVA Xiamen MMC-HVDC project with ± 320 kV dc-link voltage, aiming to evaluate the effect of the faulty submodules on the reliability and power losses of the converter. Finally, the remaining challenges and opportunities in the converter fault tolerance in MMC-HVDC systems are stated as well as the future directions of this field.

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Section: Semiconductor Technology and Bypassmentioning

confidence: 99%

On Converter Fault Tolerance in MMC-HVDC Systems: A Comprehensive Survey

Farias

Cupertino

Pereira

et al. 2021

IEEE J. Emerg. Sel. Topics Power Electron.

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“…Siemens uses a press-pack thyristor to bypass the diodes D 2 during faulty operation [40]; • RXPE considers the use of press-pack diodes to withstand the surge current integral [41]; • ABB has similar considerations, cells based on IGCT have a full short-circuit failure mode (SCFM) which allows the removal of the bypass switch to use a single bypass thyristor to discharge the cell capacitor [42,43]. The conclusion is different with DC circuit-breakers, as shown in Table 10, surge current integrals are much smaller because of the drastic reduction of fault-interruption time.…”

Section: Surge Current Integralsmentioning

confidence: 99%

Simulation Model to Analyze the Consequences of DC Faults in MMC-Based HVDC Stations

2021

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The global development of high-voltage direct-current (HVDC) systems in fields such as renewable energy sources, interconnection of asynchronous grids or power transmission over great distances, is unquestionably important. Though widely used, the modular multilevel converter with half-bridge cells is sensitive to DC pole-to-pole faults and the time-response of the protections is critical. Reliability and availability are paramount: circuit-breakers must minimize the effects of any fault on the converter, while ensuring rapid restart. This paper focuses on the modelling aspects to analyse the behaviour of HVDC stations during DC pole-to-pole faults, using either AC or DC circuit-breakers, with different parameters. The proposed model can represent the main issues met by the converter cells during DC faults, such as semiconductor overcurrents and overvoltages, allowing a proper design of the cells.

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“…With the development of clean and renewable energy, High-Voltage Direct Current (HVDC) power transmission technology plays a significant role in the energy transmission process between the power source and power grid. Over one hundred HVDC systems have been installed globally with more than 20 new designed projects built in the last decade [1][2]. Thus, an increasing demand for high reliable power semiconductors for these applications are required.…”

Section: Introductionmentioning

confidence: 99%

Condition monitoring of press-pack IGBT devices using Deformation Detection Approach

Gu¹,

Wu²,

Pickert³

et al. 2021

The 10th International Conference on Power Electronics, Machines and Drives (PEMD 2020)

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Press pack Insulated Gate Bipolar Transistors (PP IGBT) are gaining more attention in HVDC power transmission systems due to their high-power density and high reliability compared with conventional power modules. Condition monitoring of PP IGBTs is normally conducted by estimating the chip temperature which is challenging to implement in practice. This paper presents a new parameter, deformation of the upper lid groove, to indicate the health condition of the PP IGBT based on its unique packaging technique. The thermal-mechanical coupled model is built by FE software in order to investigate the relationship between the deformation and junction temperature of the chips. In addition, the several feasible detection methods of deformation have been discussed and utilization of the fiber Bragg grating (FBG) sensor shows the advantages as the most appropriate approach, which can be further developed for condition monitoring using deformation measurements.

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HV submodule technology based on press pack IGBT for largest scale VSC-HVDC application

Cited by 13 publications

References 0 publications

On Converter Fault Tolerance in MMC-HVDC Systems: A Comprehensive Survey

On Converter Fault Tolerance in MMC-HVDC Systems: A Comprehensive Survey

Simulation Model to Analyze the Consequences of DC Faults in MMC-Based HVDC Stations

Condition monitoring of press-pack IGBT devices using Deformation Detection Approach

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