How to better know what happens inside a power multi chip module

Clavel, Édith; Roudet, James; Schanen, Jean‐Luc

doi:10.1109/pesc.1997.616803

Cited by 4 publications

References 6 publications

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Electrical modeling of transformer connecting bars

2002

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Traditionally, connections in high-voltage, high-current, and low-frequency circuits are always considered as perfect short circuits, so to analyze their contribution to electrical performance of a structure is not considered necessary. We show here that, even for low-frequency structures, the electrical parasitic characteristics of cabling can lead to some unexpected performances. In particular, our study of outside connections of a 400 MVA transformer has shown current unbalances between the three phases and inside the phases. We achieved this by using a semianalytical method that is presented in this paper. Results show the need to model this part of the structure. This method has advantages over numerical techniques of calculation.Index Terms-Electrical modeling, parasitic inductance of connections, PEEC method.

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Electrical modeling of transformer connecting bars

2002

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Design of a commutation cell of a high power IGBT inverter-the contribution of the simulation

Clavel

Roudet²,

Maréchal³

IAS '97. Conference Record of the 1997 IEEE Industry Applications Conference Thirty-Second IAS Annual Meeting

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The use of fast semiconductors components in high power inverters implies relatively severe constraints for cabling. Indeed, the turn off of switches (here IGBT) generates dldt of some 2 000 N p s which can create, via parasitic inductances of the commutation cell, prohibitive overvoltages which can become destructive. This paper shows on a representative industrial example that from now on it is possible to precisely e valuate this parasitic inductance directly from geometrical parameters of connections. The cabling which is use in this industrial application is made by bus bar technology according to the power range. The very good agreement between experiment and simulation results shows that it is realistic to widely use modelling to design connections in power electronics.

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Optimization of cabling in power electronics structure using inductance criterion

Piette¹,

Clavel²,

Maréchal³

Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242)

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The Power Electronics applications require to design more and more structures and control the parasitic loop inductance because of increasing current and voltage levels induced by used components (IGBT). Part of this parasitic inductance is due to non perfect connections and is directly linked to their geometrical characteristics. Therefore we present in this paper a methodology to improve the geometry of the cabling of all converters in order to limit the parasitic loop inductance, while keeping its compactness. The optimization is based on two steps : first an analysis of the structure and then the optimization of the cabling.

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How to better know what happens inside a power multi chip module

Cited by 4 publications

References 6 publications

Electrical modeling of transformer connecting bars

Electrical modeling of transformer connecting bars

Design of a commutation cell of a high power IGBT inverter-the contribution of the simulation

Optimization of cabling in power electronics structure using inductance criterion

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