Abstract:Modern market requires smaller products with more functionalities which are driven by high speed Package Circuit Boards (PCBs) and Integrated Circuit (IC) packages. Thermal control of PCBs and IC packages is challenging in microelectronics because the power density increases when smaller and more complicated packages are designed. Temperature rise due to power dissipation, hotspot worsens harmful clock skew, jeopardizes reliability of products. To overcome these risks, PCBs and IC packages designers have to pe… Show more
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