Materials Science and Technology 2006
DOI: 10.1002/9783527603978.mst0201
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Hot Isostatic Pressing

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Cited by 28 publications
(10 citation statements)
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“…To see whether further treatment could improve the performance, heat treatment under hot isostatic pressing (HIP) was also investigated. HIP is often performed during manufacture to release internal stresses within the materials used 36 . The effect of applying HIP treatment prior to annealing on a 3D-printed test piece can be seen in figure 4 C. The details of the HIP cycle parameters can be found in the Methods section.…”
Section: Resultsmentioning
confidence: 99%
“…To see whether further treatment could improve the performance, heat treatment under hot isostatic pressing (HIP) was also investigated. HIP is often performed during manufacture to release internal stresses within the materials used 36 . The effect of applying HIP treatment prior to annealing on a 3D-printed test piece can be seen in figure 4 C. The details of the HIP cycle parameters can be found in the Methods section.…”
Section: Resultsmentioning
confidence: 99%
“…This results in a Si 3 N 4 ceramic with a minimum of residual grain boundary glass. Two typical HIP methods are known [259][260][261] as follows: i) Encapsulation HIP method where full densification can be obtained at relatively low temperatures by simultaneous treatment of heating and pressurizing and a basis requirement is necessary such as the encapsulation of the green porous compact, so that a deformable gas-impermeable membrane form around it, at the processing temperature and acts by transmitting the applied isostatic pressure [44,262,263] and ii) Sinter + HIP (capsuleless HIP), method that enables us to do HIP treatment without capsule. In this method, the green compacts are sintered and subsequently hot isostatically pressed during the same cycle [256,262].…”
Section: Hot Isostatic Pressing Of Silicon Nitridementioning
confidence: 99%
“…According to ASTM 897-90, ADI is classified from 800 up to 1600MPa [3]. Larker [4] patented the method of manufacturing of high silicon ADI containing 3,35-4,60% Si. As a result of austenitizing at temperatures above 910 o C and isothermal quenching at a temperature of 250-380 o C he obtained the casting with ultimate tensile strength around 900MPa and elongation at least 9%.…”
Section: Introductionmentioning
confidence: 99%