Over the barrier, hot electron transport across 8 nm thick amorphous Al 2 O 3 layers embedded in metal-oxide-semiconductor ͑MOS͒ structures was investigated with ballistic electron emission microscopy ͑BEEM͒. The oxide field dependence of the BEEM threshold voltage V th , which corresponds to the potential maximum of the barrier, was found to be dominated by image force and charge trapping/detrapping effects. The static barrier height at the W-Al 2 O 3 interface ⌽ B ϭ3.90 Ϯ0.03 eV and the dynamic dielectric constant ⑀ if ϭ1.86Ϯ0.1, which reflects the strong image force lowering of the barrier observed at both interfaces. A band offset between the Al 2 O 3 and Si conduction bands of 2.78Ϯ0.06 eV was deduced. Electron trap levels at energies overlapping the Si band gap and of densities in the 10 12 cm Ϫ2 range were deduced to lie in the oxide near the Al 2 O 3 -Si interface. Their occupancy is determined by the position of the interface Fermi level. For p-type substrates the traps were empty ͑filled͒ for positive ͑negative͒ applied bias. Local, electrical stressing increased the interface trap charge for n-type substrates, but had negligible consequences on p-type substrates. The Al 2 O 3 was readily stressed to failure upon injecting sub-nano-Coulomb of charge at electron kinetic energies in the 4-6 eV range.