Homogenization of the zirconium carbide–titanium interface domain

Diffusion Bonding of Metal Wires Directly to the Functional Metal Oxide Semiconductors for Forming Reliable Electrical Contacts

“…Diffusion bonding is known to produce strong and stable joints between metals and ceramic bodies. − The strength of these solid-state bonds is strongly temperature- and pressure-dependent; sturdier joints are produced at higher temperature and pressure. The temperature utilized is usually larger than T m /2, where T m is the melting temperature of the metal in °C, and the exerted pressure is in the 1–50 MPa range. − The optimum conditions for diffusion bonding, however, depends on the microstructures of the bonding materials; the formation of diffusion bonds at room temperature between different nanostructured metals and metal oxides have been demonstrated. − …”