Abstract:The design of a prototype multichip module utilizing free-space holographic optical interconnects is discussed. This prototype incorporates GaAs laser array chips and silicon CMOS chips which are flip-chip bonded to the transparent MCM substrate. Computer generated holograms are etched onto the opposite side of the MCM substrate to form optical links between lasers and photodetectors that are integrated onto the CMOS chips. Comparisons are then performed between optical interconnects and electrical interconnec… Show more
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