“…Since the development of the Unbalanced Magnetron (UBM) sputtering cathode in the late 1980s (Window and Savvides, 1986a;1986b;Savvides and Window, 1986), magnetron sputtering has become the most important technology for the deposition of thin films. Furthermore, several types of magnetron sputtering cathode have been developed continuously from 1980s until recent years (Teer, 1989;Sproul et al, 1990;Kelly and Arnell, 2000;Musil et al, 2005;Rastogi et al, 1978;Swann, 1988;Münz, 1991;Sproul, 1991;Chen et al, 1994;Zheng et al, 1994;Okimura et al, 1995;1996;Muralidhar et al, 1995;Ai et al, 2000;Ejima and Shimizu, 2001;Pradhan et al, 2002;Svadkovski et al, 2002;Gudmundsson, 2008;Ehiasarian, 2010;Sasaki et al, 2012;Yamada et al, 2014;Britun et al, 2015;Motomura and Tabaru, 2017). Two types of unbalanced magnetron were described by (Window and Savvides, 1986b) as shown in Fig.…”