Highly Thermally Conductive Fluorinated Graphene Films with Superior Electrical Insulation and Mechanical Flexibility

Abstract

Graphene-based heat-spreading films have captured high attention in academic study and commercial applications because of their extremely high thermal conductivity and desired flexibility. However, the electrical conductivity limits their utilizations in many electronic fields. Herein, to address this problem, fluorinated graphene (F-graphene) that is exfoliated from commercial fluorinated graphite was first used to prepare the flexible free-standing composite film via vacuum filtration of uniform poly­(vinyl alcohol)-assisted F-graphene suspension. The well-organized alignment of F-graphene lamellas makes the composite film show an ultrahigh in-plane thermal conductivity of 61.3 W m–1 K–1 at 93 wt % F-graphene. Despite at such high filler loading, the fabricated F-graphene film still possesses a superior electrical insulation property. Therefore, these results suggest that F-graphene, as the novel thermally conductive filler, demonstrates fascinating characters in the preparation of a thermally conductive yet electrically insulating nanocomposite.

Carbonization of Polydopamine-Coating Layers on Boron Nitride for Thermal Conductivity Enhancement in Hybrid Polyvinyl Alcohol (PVA) Composites

“…Figure 6 a shows BNPDA embedded into the PVA matrix, demonstrating good affinity with each other. The –NH and –OH groups from PDA could form strong hydrogen bonds with –OH from PVA chains, resulting in the gluing effect [ 28 ]. With the increasing annealing temperature of BNPDA, the hydrogen bonds between the filler and matrix could be broken through the carbonization process, leading to a decrease in interface affinity.…”

Aerogel Perfusion-Prepared h-BN/CNF Composite Film with Multiple Thermally Conductive Pathways and High Thermal Conductivity

“…Exfoliation is a common method to obtain the micro-nano h-BN [39]. Therefore, it is desirable to increase the contact area and decrease the inter-layered gap between h-BN for the conductive network construction, leading to the relatively gentle phonon scattering at the interfaces of h-BN and thus the high thermal transfer efficiency [2]. Figure S1 presents the schematic of exfoliation of h-BN.…”

“…The rapid development of miniaturization, integration, and high-power electronic devices brings with it higher requirements for their effective heat-dissipation properties [1,2,3]. Considerable heat will be accumulated and make an electronic device heat up during the working process if the heat cannot be transferred out rapidly.…”

“…Considerable heat will be accumulated and make an electronic device heat up during the working process if the heat cannot be transferred out rapidly. This will affect the operation quality considerably, and compromise the lifetime and reliability of electronic devices significantly [2,4,5], or even cause an explosion and other serious accidents [6,7]. It is vital for the electronic and electrical industry to prevent heat accumulation in the electronic devices by exporting the heat in a timely way [6,8,9,10].…”

Fabrication of High Thermally Conductive and Electrical Insulating Composites by Boron Nitride‐Nanosheet‐Coated PEEK Fiber

“…[4,5] Therefore, it is necessary to develop efficient heat-dissipating and insulating materials, while maintaining a low density and the required mechanical properties. [6,7] The most economical and effective method to fabricate composites is to embed thermally conductive fillers into the polymer matrix such as ceramics, [8,9] metal oxides, [5,10] and carbon nanomaterials. [11,12] 2D materials have attracted the extensive attention of many DOI: 10.1002/mame.202100532 scientists due to their excellent quantum transfer characteristics and mechanical properties.…”