Abstract:With the increasing integration and power density of electronic and electrical equipment, highly thermally conductive insulating materials have a wide range of application scenarios. In this paper, a novel core–shell structure fiber thermal conductive filler hexagonal boron nitride@anatase titanium dioxide (h‐BN@AT) has been prepared by electrospinning technology first. The h‐BN@AT/epoxy resin (EP) thermally conductive and insulating composite was prepared by hot pressing. When the filler content was 30 wt%, t… Show more
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