Highly thermal conductivity and flame retardant flexible graphene/MXene paper based on an optimized interface and nacre laminated structure

Liu, Yingchun; Wu, Kun; Lu, Maoping; Jiao, Enxiang; Zhang, Hangzhen; Shi, Jun; Lu, Mangeng

doi:10.1016/j.compositesa.2020.106227

Cited by 46 publications

(20 citation statements)

References 46 publications

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“…Consequently, it is considered to be a material with promising thermal conductivity and flame retardant properties. Liu et al [28] prepared MXene/graphene nanocomposite films by reduction and thermal welding at a suitable temperature. Figure 5a shows a model of the interaction between MXene and graphene.…”

Section: Inorganic Hybrid Graphenementioning

confidence: 99%

Nanocarbon-Based Flame Retardant Polymer Nanocomposites

et al. 2021

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In recent years, nanocarbon materials have attracted the interest of researchers due to their excellent properties. Nanocarbon-based flame retardant polymer composites have enhanced thermal stability and mechanical properties compared with traditional flame retardant composites. In this article, the unique structural features of nanocarbon-based materials and their use in flame retardant polymeric materials are initially introduced. Afterwards, the flame retardant mechanism of nanocarbon materials is described. The main discussions include material components such as graphene, carbon nanotubes, fullerene (in preparing resins), elastomers, plastics, foams, fabrics, and film–matrix materials. Furthermore, the flame retardant properties of carbon nanomaterials and their modified products are summarized. Carbon nanomaterials not only play the role of a flame retardant in composites, but also play an important role in many aspects such as mechanical reinforcement. Finally, the opportunities and challenges for future development of carbon nanomaterials in flame-retardant polymeric materials are briefly discussed.

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Section: Inorganic Hybrid Graphenementioning

confidence: 99%

Nanocarbon-Based Flame Retardant Polymer Nanocomposites

et al. 2021

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“…The process of thermal treatment can efficiently remove some functional groups and polymeric residues around the GO nanosheets for restoring the in-plane thermal conductivity, which is ascribed to formation of more sp 2 hybridized carbon structures, providing more effective channels for phonon transport. 209,215,216 Moreover, the resultant film presented a ladder-like architecture (Fig. 9a), which can facilitate the thermal transport, especially in cross-plane direction, leading to a remarkably high in-plane thermal conductivity of 565 W m −1 K −1 and a cross-plane thermal conductivity of 18.1 W m −1 K −1 .…”

Section: Inorganic Papermentioning

confidence: 99%

The gorgeous transformation of paper: from cellulose paper to inorganic paper to 2D paper materials with multifunctional properties

Dai

Guo

2022

J. Mater. Chem. A

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“…The thermal interface material (TIM) required high thermal conductivity. The thermal conductivity of polymers ranged from 0.1 to 0.5 Wm −1 K −1 [ 34 ]. The simple form of polymer matrix is insufficient to meet the thermal conductivity requirement.…”

Section: Formulation Of Thermally Conductive Adhesive and Heat Transfer Mechanismmentioning

confidence: 99%

“…Polymers 2021, 13, x FOR PEER REVIEW 5 of 24 K −1 [34]. The simple form of polymer matrix is insufficient to meet the thermal conductivity requirement.…”

Section: Formulation Of Thermally Conductive Adhesive and Heat Transfer Mechanismmentioning

confidence: 99%

Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

et al. 2021

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The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.

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Highly thermal conductivity and flame retardant flexible graphene/MXene paper based on an optimized interface and nacre laminated structure

Cited by 46 publications

References 46 publications

Nanocarbon-Based Flame Retardant Polymer Nanocomposites

Nanocarbon-Based Flame Retardant Polymer Nanocomposites

The gorgeous transformation of paper: from cellulose paper to inorganic paper to 2D paper materials with multifunctional properties

Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

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