Highly textured and twinned Cu films fabricated by pulsed electrodeposition

Cui, Bai; Han, Ke; Xin, Yan; Waryoba, Daudi R.; Mbaruku, A.

doi:10.1016/j.actamat.2007.04.009

Cited by 68 publications

(39 citation statements)

References 13 publications

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“…For both substrate types, grain sizes generally decreased with increasing current density. Another study [74] of pulsed electrodeposited copper produced MC grains with twin spacings on the order of 10 nm and twin thicknesses of less than 50 nm. In this case, twin density increased and twin thickness and spacing decreased with increasing current density.…”

Section: Deposition Techniquesmentioning

confidence: 99%

“…2), defect distribution, impurities, inclusions, precipitates, and residual stresses. There are many processing factors which affect the texture, grain size, and twin density of NC deposited films, including peak current density, bath pH, substrate crystal structure, substrate texture, and film thickness [74][75][76]. One study examining these effects compared NC copper films deposited on a bcc low carbon steel and an fcc austenitic stainless steel at varying current densities [75].…”

Section: Deposition Techniquesmentioning

confidence: 99%

“…Grain refinement through control of bath chemistry, pH and current density makes thick films more difficult to achieve since those settings must not deviate too far from ideal conditions during bath depletion. Despite some challenges, electrodeposited films with NC grain structure have been reported with thicknesses on the order of 100 µm [74,80] and even 1 mm [60].…”

Section: Deposition Techniquesmentioning

confidence: 99%

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A Review of Fatigue Behavior in Nanocrystalline Metals

2009

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Nanocrystalline metals have been shown to exhibit unique mechanical behavior, including break-down in Hall-Petch behavior, suppression of dislocation-mediated plasticity, induction of grain boundary sliding, and induction of mechanical grain coarsening. Early research on the fatigue behavior of nanocrystalline metals shows evidence of improved fatigue resistance compared to traditional microcrystalline metals. In this review, experimental and modeling observations are used to evaluate aspects of cyclic plasticity, microstructural stability, crack initiation processes, and crack propagation processes. In cyclic plasticity studies to date, nanocrystalline metals have exhibited strongly rate-dependent cyclic hardening, suggesting the importance of diffusive deformation mechanisms such as grain-boundary sliding. The cyclic deformation processes have also been shown to cause substantial mechanicallyinduced grain coarsening reminiscent of coarsening observed during large-strain monotonic deformation of nanocrystalline metals. The crack-initiation process in nanocrystalline metals has been associated with both subsurface internal defects and surface extrusions, although it is unclear how these extrusions form when the grain size is below the scale necessary for persistent slip band formation. Finally, as expected, nanocrystalline metals have very little resistance to crack propagation due to limited plasticity and the lack of crack path tortuosity among other factors. Nevertheless, like bulk metallic glasses, nanocrystalline metals exhibit both ductile fatigue striations and metal-like Paris-law behavior. The review provides both a comprehensive critical survey of existing literature and a summary of key areas for further investigation.

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Section: Deposition Techniquesmentioning

confidence: 99%

Section: Deposition Techniquesmentioning

confidence: 99%

Section: Deposition Techniquesmentioning

confidence: 99%

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A Review of Fatigue Behavior in Nanocrystalline Metals

2009

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“…Numerous research efforts have been devoted towards the preparation of copper foils with high hardness and electrical conductivity. As part of these studies, highly textured and twinned copper foils with enhanced mechanical and electrical properties were synthesized by electrodepositionusing DC and PED techniques 23,[30][31][32][33][34][35][36][37] (various reports on usage of DC and PED to deposit copper in various forms with varied microstructure and texture are summarized in supporting information).…”

Section: Introductionmentioning

confidence: 99%

Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition

Pavithra

Sarada

Rajulapati

et al. 2015

Crystal Growth & Design

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The texture evolution in copper foils prepared by a rapid pulse reverse electrodeposition (PRED) technique using an 'additive-free' electrolyte and the subsequent correlation with the mechanical and electrical properties is investigated in the present study. Control over (111), (100) and (101) crystallographic textures in copper foils has been achieved by optimization of the pulse parameters and current density. Hardness as high as 2.0-2.7 GPa, while maintaining the electrical conductivity in the same range as that of bulk copper was exhibited by these foils. The complete study of controlling the (111), (100) and (101) textures, CSL Σ3 coherent twin boundaries, grain refinement and their effect on the mechanical and electrical properties is performed in detail by characterizing the foils with electron backscatter diffraction (EBSD), X-ray diffraction (XRD), nanoindentation and electrical resistivity measurements. PRED technique with short and high energy pulses enabled the (111) texture while increasing the forward off-time with optimized current density resulted in the formation of (100) and (101) textures. The reverse/anodic pulse applied after every forward pulse aided the minimization of residual stresses with no additives in the electrolyte, stability of texture in the foils, grain refinement and formation of growth-twins.Among the three highly textured copper foils, those with dominant (111) texture exhibited a lower electrical resistivity of ~1.65×10 -6 Ω-cm and better mechanical strength compared to those with (100) and (101) textures.

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“…19,20) In the present work, the nanoscale lamellar Co-Cu alloy is annealed at 673-973 K to change its microstructure, and the relationships between the annealing temperature and the microstructure such as the lamellar spacing are examined. In addition, the effects of the nanoscale lamellar structure on the mechanical properties of Co-Cu alloy are investigated.…”

Section: Introductionmentioning

confidence: 99%

Effect of Annealing on Mechanical Properties and Nanoscale Lamellar Structure in Co-Cu Alloy

et al. 2009

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An electrodeposited Co-Cu alloy with a nanoscale lamellar structure was annealed at 673-973 K. The effects of annealing on the mechanical properties and the microstructures of the alloy such as the lamellar area ratio and the lamellar spacing were investigated. The Young's modulus of the Co-Cu alloy increased by annealing. This is mainly due to a decrease in the lamellar area ratio. The as-deposited specimens exhibited a low value of the activation volume for plastic deformation; however, the activation volume was increased by annealing. This appears to be related to an increase in lamellar spacing caused by annealing. The origins of the lamellar spacing dependence of the activation volume are discussed from the viewpoint of the emission of dislocations from the lamellar boundary.

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Highly textured and twinned Cu films fabricated by pulsed electrodeposition

Cited by 68 publications

References 13 publications

A Review of Fatigue Behavior in Nanocrystalline Metals

A Review of Fatigue Behavior in Nanocrystalline Metals

Controllable Crystallographic Texture in Copper Foils Exhibiting Enhanced Mechanical and Electrical Properties by Pulse Reverse Electrodeposition

Effect of Annealing on Mechanical Properties and Nanoscale Lamellar Structure in Co-Cu Alloy

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