Highly solderability of FeP film in contact with SnAgCu solder

Zhou, Hang; Guo, Jingdong; Shang, Jianku; Song, Xiaoning

doi:10.1016/j.jallcom.2019.152900

Cited by 5 publications

(2 citation statements)

References 20 publications

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“…SnPb solder is widely used in electronic packaging due to its low price, good wettability, and low melting point. , However, the European Union passed the Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substance (ROHS) directives to ban the use of Pb in electronic products due to its toxicity. , Therefore, the research on lead-free solder has become a hot topic. At present, the main lead-free solders include SnCu, SnAgCu, SnAg, SnBi, and SnZn. − SnCu solder is considered a good substitute for SnPb solder for its low cost, low resistivity, and excellent mechanical properties . However, the formation of excessively thick scalloped intermetallic compounds (IMCs) at the Sn-0.7Cu/Cu interface during the soldering process can easily make the solder joints break and cause malfunction, thereby affecting the service life of electronic equipment. , …”

Section: Introductionmentioning

confidence: 99%

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Gao

Lin

et al. 2023

ACS Appl. Nano Mater.

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The application of Sn-0.7Cu solder in electronic packaging is limited by its high melting point, low wettability, and poor solderability. Herein, we obtain Co nanoparticles embedded in carbon skeleton nanosheets (Co&C) via a metal-organicframework (MOF)-derived method. The composite solder is successfully prepared by adding Co&C into Sn-0.7Cu. The results show that the addition of minor amounts of Co&C has little influence on the melting point of the composite solder. In addition, the wettability of the composite solder is effectively enhanced by the adsorption effect of Co&C. The minimum wetting angle of the composite solder is 27.9°when the content of Co&C is 0.08 wt %. With the addition of Co&C, the microstructure of the solder is refined, and the best refinement effect is achieved when the content of Co&C is 0.08 wt %. Furthermore, adding Co&C can reduce the thickness of the intermetallic compounds (IMCs) and transform the scalloped IMCs into a planar shape. Reflowed for 2100 s, the IMCs at the Sn-0.7Cu-0.08Co&C/Cu interface maintain a planar shape, and their thickness is reduced by 21.10% compared with that of the Sn-0.7Cu/Cu interface. The synergistic effect between Co and carbon in Co&C jointly controls the interface reaction and the growth of IMCs.

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Section: Introductionmentioning

confidence: 99%

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Gao

Lin

et al. 2023

ACS Appl. Nano Mater.

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“…Therefore, research on lead-free solder has become a popular trend in the electronics industry. Lead-free solder mainly includes SnCu [4,5], SnAgCu [6,7], SnAg [8], SnZn [9], etc., systems, among which SnCu solder is expected to replace SnPb solder due to its low cost, high strength, and low resistivity [10]. However, electronic products such as communication equipment and control equipment of ships are exposed to humid corrosive media, which increases the need for the corrosion resistance of SnCu solder [11].…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Lin

Gao

et al. 2022

Metals

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The corrosion resistance of solder joints is a critical factor affecting the service life of electronic products during long-term operation. In this study, the corrosion behavior of Sn-0.7Cu-xNi@C (x = 0, 0.04, 0.08, and 0.12 wt.%) composite solders was investigated using a Tafel polarization curve in 3.5 wt.% NaCl solution, and the result demonstrated that it was the Ni@C that enhanced the corrosion resistance of the composite solder. The corrosion rate of the composite solders decreased with increasing Ni@C content and reached the lowest value of 0.205 mm/y when the content of Ni@C reached 0.08 wt.%. Ni@C changed the morphologies of corrosion products Sn3O(OH)2Cl2 from thick flakes to dense fine needles and flakes, which made it more difficult for Cl– to break down corrosion products. Thus, the corrosion resistance of composite solder was improved. The carbon skeleton in Ni@C served as an inert physical barrier to inhibit further corrosion. Furthermore, the potential difference between IMC and β-Sn decreased with the addition of Ni@C, which reduced the corrosion rate of the electric couple and enhanced the corrosion resistance of the composite solder.

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Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications

Wang

et al. 2022

J Mater Sci: Mater Electron

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Highly solderability of FeP film in contact with SnAgCu solder

Cited by 5 publications

References 20 publications

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Effects of Co Nanoparticles Embedded in Carbon Skeleton Nanosheet Addition to Sn-0.7Cu Solder on the Interfacial Reaction

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications

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