“…Examples of flexible sensors integrating additional electronic functions like readout electronics [ 5 , 6 ], thermal compensation systems [ 7 ], and other sensors [ 8 , 9 ] have opened a new route towards multi-functional sensors fabricated on flexible substrate. Despite that, silicon technology is still attractive for the fabrication of sensors due to its mass-production capability, its high degree of miniaturization resulting in high integration density, and, consequently its considerable cost reduction for sensor devices [ 10 , 11 ]. Indeed, as given in the paper of Moore in 1965 [ 12 ]: “With unit cost falling as the number of components per circuit rises”, the cost of one sensor must also decrease as more sensors are put on the substrate.…”