Atomic layer deposition
(ALD) is widely used in science and technology,
particularly in microelectronics, because it allows well-controlled
production of highly conformal thin films. Technoindustrial advancements
in microelectronics require more accurate guidance of deposition,
as features in electronic devices keep shrinking. Therefore, improved
lithographic capabilities are needed, and bottom-up, self-aligned
methods of lithography have attracted much attention. In this context,
step decoration has been extensively explored for some decades, but
ALD was seldom, if ever, considered. Gaining a better fundamental
understanding of such processes is an important milestone toward their
practical implementation. Here, using trimethyl(methylcyclopentadienyl)platinum(IV),
MeCpPtMe3, and O3 on terraced α-Al2O3 (sapphire) miscut surfaces, we demonstrate selective
deposition of platinum particles deposited by ALD. An observed interconnection
between the selectivity and the miscut angle of the surface was discussed
and modeled. These results shed light on the role of low-coordination
surface-sites on terraced surfaces in the guidance of deposition performed
by ALD.