Highly multicolored light-emitting arrays for compressive spectroscopy

Abstract

Miniaturized, multicolored light-emitting device arrays are promising for applications in sensing, imaging, computing, and more, but the range of emission colors achievable by a conventional light-emitting diode is limited by material or device constraints. In this work, we demonstrate a highly multicolored light-emitting array with 49 different, individually addressable colors on a single chip. The array consists of pulsed-driven metal-oxide-semiconductor capacitors, which generate electroluminescence from microdispensed materials spanning a diverse range of colors and spectral shapes, enabling facile generation of arbitrary light spectra across a broad wavelength range (400 to 1400 nm). When combined with compressive reconstruction algorithms, these arrays can be used to perform spectroscopic measurements in a compact manner without diffractive optics. As an example, we demonstrate microscale spectral imaging of samples using a multiplexed electroluminescent array in conjunction with a monochrome camera.

A Color-Tunable Alternating Current Organic Light Emitting Capacitor

“…However, the tandem structure composed of separate RGB driving units requires complex electrode connections, whereas the voltage dependent color control has several drawbacks such as recombination zone shifts, uncontrollable exciton quenching, and intensity change while shifting the emission spectrum. Meanwhile, AC driven LEDs are dragging attention due to their efficient color change and facile fabrication process. ,, However, the AC LEDs share a similar structure as conventional multilayered organic LEDs , which suffer from the large number of processing steps and require a large amount of material usage, increasing the fabrication cost. , In contrast, a recently demonstrated AC driven light emitting capacitor (LEC) comprises of a single emissive layer with a contact that injects both electrons and holes. − This simple device has several advantages such as facile processing, compatibility with a wide variety of emitting materials, and efficient charge injection without the need for contact engineering. , …”