2022
DOI: 10.1016/j.solener.2022.07.003
|View full text |Cite
|
Sign up to set email alerts
|

Highly improved passivation of PECVD p-type TOPCon by suppressing plasma-oxidation ion-bombardment-induced damages

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

1
3
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
7
1

Relationship

1
7

Authors

Journals

citations
Cited by 15 publications
(4 citation statements)
references
References 30 publications
1
3
0
Order By: Relevance
“…Figure 13a compares the measured iV OC of the samples with and without SiO 2 for a poly Si layer with d poly Si,1 = 155 nm. For H p < 4.6 J/cm 2 , the majority of samples with SiO 2 show a good passivation quality with the highest iV OC = 721 mV, which is comparable with the highest reported values for p + -poly Si/SiO 2 passivation stacks [38,39]. The reason for the slight reduction in iV OC for 2 J/cm 2 < H p < 2.6 J/cm 2 is not clear and requires further scrutiny.…”
Section: Passivationsupporting
confidence: 55%
“…Figure 13a compares the measured iV OC of the samples with and without SiO 2 for a poly Si layer with d poly Si,1 = 155 nm. For H p < 4.6 J/cm 2 , the majority of samples with SiO 2 show a good passivation quality with the highest iV OC = 721 mV, which is comparable with the highest reported values for p + -poly Si/SiO 2 passivation stacks [38,39]. The reason for the slight reduction in iV OC for 2 J/cm 2 < H p < 2.6 J/cm 2 is not clear and requires further scrutiny.…”
Section: Passivationsupporting
confidence: 55%
“…[ 19–21 ] Conversely, boron‐doped (B‐doped) poly ‐Si contacts have a lower iV oc of ∼710 mV with a J 0 value of ∼10 fA cm −2 . [ 6,22 ] This phenomenon of inferior boron‐doped contacts was previously observed in the bipolar junction and field‐effect transistors in the 1990s. [ 23,24 ] Several studies have attributed it to the tendency of B to segregate at the interface between SiO x and c ‐Si, [ 25–30 ] increasing the density of interface defects.…”
Section: Introductionmentioning
confidence: 65%
“…In this work, industry-compatible fabrication methods, such as ambient-pressure thermal oxidation (APTO) and in-situ plasma-enhanced chemical vapor deposition (PECVD), are employed to prepare highly passivated p-TOPCon structures and double-sided TOPCon bottom cells on industrial textured wafers. The use of thermal oxidation avoids damages from ion-bombardment during the high-power plasma oxidation 11,12 , and in-situ PECVD realizes single-side deposition and doping with high versatility. Chemical and fieldeffect passivation are significantly promoted through mitigating ultrathin SiOx distortion by stronger oxidation, enhancing boron in-diffusion by employing a higher thermal budget, and suppressing high residual defect density by strengthened hydrogenation.…”
Section: Introductionmentioning
confidence: 99%