2018
DOI: 10.1177/0954008318802946
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Highly improved mechanical and dielectric properties of paper-based composites with polyimide chopped fiber functionalized by ethylenediamine

Abstract: In this study, polyimide (PI) chopped fibers were modified by ethylenediamine, and PI paper-based composites were fabricated using the as-modified PI chopped fibers and para-aramid fibrids which served as raw materials through the wet-forming process. The influence of different alkali treatment durations on the properties of PI fibers and composites was investigated. In sharp contrast with the pristine PI fibers, there was a satisfying difference in modified PI fibers including rougher surfaces and improved we… Show more

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Cited by 10 publications
(2 citation statements)
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“…Consequently, making PI fibers surface rich in functional groups is vital because the surface of PI fibers usually shows chemically inert and smooth. Compared with other surface‐modification methods, such as coupling agents, plasma, and radiation, surface grafting is a brightly prospected surface modification technique, which can introduce small molecules, polymer layers, and nanoparticles with specific functional groups on the fiber surface by unique chemical reactions, thus contributing to the multiple applications of PI fibers 25–27 …”
Section: Introductionmentioning
confidence: 99%
“…Consequently, making PI fibers surface rich in functional groups is vital because the surface of PI fibers usually shows chemically inert and smooth. Compared with other surface‐modification methods, such as coupling agents, plasma, and radiation, surface grafting is a brightly prospected surface modification technique, which can introduce small molecules, polymer layers, and nanoparticles with specific functional groups on the fiber surface by unique chemical reactions, thus contributing to the multiple applications of PI fibers 25–27 …”
Section: Introductionmentioning
confidence: 99%
“…Treatments based on alkaline solutions, such as KOH or NaOH can be used to join two layers of polyimide [27] or PI fibers with epoxy [28]. Finally, amine-based treatments can also improve the bonding of PI films or fibers with other polymers [29,30].…”
Section: Introductionmentioning
confidence: 99%