Highly heat-resistant poly(о-hydroxy amide) binders of polyfunctional composites for microelectronics

Lebedeva, G. K.; Bazhenova, A. S.; Rudaya, L. I.; Gofman, I. V.; Marfichev, A. Yu.; Bol'shakov, M. N.; Sokolova, I. M.; Chigirev, D. S.; Рамш, С. М.; Шаманин, В. В.

doi:10.1134/s107042721610013x

Cited by 8 publications

(11 citation statements)

References 4 publications

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“…2-(Chloromethyl)oxirane 98 % (Panreac Quimica S.L.U, CAS 106-89-8, Barcelona, Spain) was distilled before use. 5,5-Methylene bis (2-aminophenol) was prepared according to the technique described in [32]. Synthesis conditions of POA-F were similar to those used for the preparation of POA-Si [43].…”

Section: The Methods Of Producing Of Pbo and Pbo-f Polymer Matrices Amentioning

confidence: 99%

“…Upon increase in the loaded amount of ferroelectric filler up to 40-45 vol.%, the ε value reaches 400, although the tanδ value, as expected, increases and exceeds 0.1, and more.The use of polymeric dielectric matrix that possesses enhanced electrical insulation properties is a reason for increasing electric strength of the composite films. The polymer matrix is also responsible for heat resistance of composite coating, for degree of adhesion to substrates of various chemical natures, and formation of the interface between polymer matrix and filler grains.In the current work, with the purpose of enhancing dielectric parameters of ferroelectric/polymer film composites, we used polymer matrices such as poly(benzoxazoles) (PBO [15,32,33] and PBO-F), obtained by a heat treatment of cyclodehydrationofpoly(o-hydroxyamides) (POA and POA-F). After thermal treatment (which causes chemical reaction of cyclodehydration), POA is transformed into highly hydrophobic poly(benzoxazole), PBO.…”

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confidence: 99%

“…In the current work, with the purpose of enhancing dielectric parameters of ferroelectric/polymer film composites, we used polymer matrices such as poly(benzoxazoles) (PBO [15,32,33] and PBO-F), obtained by a heat treatment of cyclodehydrationofpoly(o-hydroxyamides) (POA and POA-F). After thermal treatment (which causes chemical reaction of cyclodehydration), POA is transformed into highly hydrophobic poly(benzoxazole), PBO.…”

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confidence: 99%

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Composite Ferroelectric Coatings Based on a Heat-Resistant Polybenzoxazole Polymer Matrix

et al. 2020

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The polycondensation of 5,5-methylene bis(2-aminophenol) and the mixture of diamines 5,5-methylene bis(2-aminophenol) and 4,4-(hexafluoroisopropylidene)dianiline (molar ratio 0.8:0.2) with isophthaloyl dichloride was used to synthesize a new heat resistant binder of the composites for microelectronics: poly(o-hydroxyamide) (POA) and poly(amido-o-hydroxy amide) (POA-F). The thermal stability of synthesized polymer coatings, as well as based on them photosensitive compositions with a naphthoquinondiazide photosensitive component were studied in the temperature range from 100 to 500 °C. Ferroelectric composites with nanodispersed lead titanate zirconate powder filler were formed based on these polymer matrices. By manipulating the conditions of the polymer formation, we obtained matrices with different stiffnesses, which reflected on the properties of the composite. The electrophysical parameters of the synthesized polymer and ferroelectric composite coatings were measured in the frequency range from 0.1 Hz to 1.5 GHz and the temperature range from 0 to 300 °C. The frequency and temperature stability of the dielectric constant of ferroelectric composite coatings up to 10 MHz and 300 °C, respectively, are noted. The influence of the composition and structure of the polymer matrix and the grain/matrix interfaces on the thermal stability of the dielectric parameters of composite films is estimated. The shift of the phase transition region toward higher temperatures in the composite structure, as well as the sufficient rigidity of the poly(benzoxazole) matrix, provide high temperature and frequency stability of the dielectric constant of the studied composites.

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Section: The Methods Of Producing Of Pbo and Pbo-f Polymer Matrices Amentioning

confidence: 99%

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confidence: 99%

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confidence: 99%

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Composite Ferroelectric Coatings Based on a Heat-Resistant Polybenzoxazole Polymer Matrix

et al. 2020

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“…[1,2,3,4,5,6]. The choice of manufacturing method of the composite (dielectric matrix/nanodispersed ferroelectric filler) would greatly eliminate uncertainty in the microstructure and the size of the ferroelectric grains.…”

Section: Introductionmentioning

confidence: 99%

“…A synthesis of new polymeric composites with ferroelectric fillers and study of their properties are urgent tasks of the growing practical application of these materials in various fields of technology, such as radio-, opto- and acousto-electronics, nonlinear optics, etc. [ 1 , 2 , 3 , 4 , 5 , 6 ]. The choice of manufacturing method of the composite (dielectric matrix/nanodispersed ferroelectric filler) would greatly eliminate uncertainty in the microstructure and the size of the ferroelectric grains.…”

Section: Introductionmentioning

confidence: 99%

Heat-Resistant Ferroelectric-Polymer Nanocomposite with High Dielectric Constant

et al. 2018

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The high dielectric constant ferroelectric-polymer nanocomposite was developed for producing the heat-resistant and chemical stable planar layers. According to the composite coatings formation conditions, the following value ranges of dielectric constant and loss factor were received: 30–400 for dielectric constant and 0.04–0.1 for loss tangent, accordingly. Unlike of composite components, the obtained composite material is characterized by thermo-stability of electrical parameters up to 250 °C. The dielectric frequency spectra of the composite exhibit two clearly visible peaks in contrast to the spectra of the polymer and ferroelectric ceramics. The developed composite material can be used as a built-in film capacitors material in microelectronic devices.

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Novel hydroxyl‐containing and thermo‐dehydrocyclizable polycondensation polymers for multifunctional materials: Synthesis, properties, application

Lebedeva

Кононова

Kruchinina

et al. 2021

J of Applied Polymer Sci

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Novel poly(amide‐imide)s and poly(amide‐o‐hydroxy‐imide)s were synthesized in the process of low‐temperature polycondensation of diacid chloride of 2‐(4‐carboxyphenyl)‐1,3‐dioxoisoindoline‐5‐carboxylic acid with a single diamine of 5,5′‐methylenebis(2‐aminophenol (DADHyDPhM) or of 4,4′‐methylenebis(benzeneamine) (DADPhМ), and also with a mixture of named diamines (molar ratios of DADHyDPhM to DADPhМ being equal to 7:3, 1:1, and 3:7). The influence of hydroxy‐imide modifying units (fragments) introduced into the basic poly(amide‐imide) on its thermal stability (the processes of polymers destruction proceed intensively in the temperature range from 400 to 600°C and has a complex character); parameters of pervaporation through heat‐resistant films prepared from polymer solutions were analyzed. Polymer films are rigid materials (modulus of elasticity–3 to 4 GPa) with a strength above 100 MPa. Heating up to 300°C leads for all three compositions to a noticeable increase in the elastic modulus and to a pronounced tendency to increase the strength characteristics.

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Highly heat-resistant poly(о-hydroxy amide) binders of polyfunctional composites for microelectronics

Cited by 8 publications

References 4 publications

Composite Ferroelectric Coatings Based on a Heat-Resistant Polybenzoxazole Polymer Matrix

Composite Ferroelectric Coatings Based on a Heat-Resistant Polybenzoxazole Polymer Matrix

Heat-Resistant Ferroelectric-Polymer Nanocomposite with High Dielectric Constant

Novel hydroxyl‐containing and thermo‐dehydrocyclizable polycondensation polymers for multifunctional materials: Synthesis, properties, application

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