Abstract:Ternary CuZrTi metallic glass thin films synthesized by sputtering are suggested as highly flexible and corrosion-resistant encapsulation materials. Unlike nanocrystalline Cu and binary CuZr metallic glass thin films, the ternary CuZrTi metallic glass thin films retain amorphous structure and do not oxidize even after 1000 h in an accelerated harsh environment at 85 °C with 85% relative humidity. The encapsulation performance of 260 nm thick ternary CuZrTi metallic glass is maintained even after 1000 bending c… Show more
“…In addition to the common‐used epoxy resins, novel acrylic monomers as adhesives also have promising applications in OSC encapsulation. [ 143 ] Recently, plasma polymers, [ 144 ] metallic glass, [ 145 ] and composite films [ 146 ] have also been used as encapsulation materials for OSCs. In general, inorganic encapsulation materials are effective in inhibiting the penetration of water and oxygen.…”
Section: Research Progress On Strategies To Enhance the Stability Of ...mentioning
Organic solar cells (OSCs) are a promising photovoltaic technology that employs organic semiconductor material as the photoactive layer, which has the unique advantages of light weight, large‐area flexible fabrication, low‐cost, and semitransparent. In recent years, the performance of OSCs has been significantly improved, and the highest power conversion efficiency has exceeded 19%. Despite the tremendous progress in OSCs, the major bottleneck in realizing the commercialization of OSCs is the device stability. Therefore, reviewing the recent research progress on the stability of high‐performance OSCs is urgent and necessary. This review discusses the factors limiting device lifetime, such as metastable morphology, air, irradiation, heat, and mechanical stresses. Additionally, this review presents the research progress over the last 5 years, focusing on enhancing device stability from the perspective of photoactive layers and other functional layers, which includes material design and device engineering, such as solid additives, device fabrication, optimizing buffer layers, using stable electrodes, and encapsulation. Lastly, this review explores current commercialization challenges and prospects, including using advanced machine learning techniques to assist experimental research.
“…In addition to the common‐used epoxy resins, novel acrylic monomers as adhesives also have promising applications in OSC encapsulation. [ 143 ] Recently, plasma polymers, [ 144 ] metallic glass, [ 145 ] and composite films [ 146 ] have also been used as encapsulation materials for OSCs. In general, inorganic encapsulation materials are effective in inhibiting the penetration of water and oxygen.…”
Section: Research Progress On Strategies To Enhance the Stability Of ...mentioning
Organic solar cells (OSCs) are a promising photovoltaic technology that employs organic semiconductor material as the photoactive layer, which has the unique advantages of light weight, large‐area flexible fabrication, low‐cost, and semitransparent. In recent years, the performance of OSCs has been significantly improved, and the highest power conversion efficiency has exceeded 19%. Despite the tremendous progress in OSCs, the major bottleneck in realizing the commercialization of OSCs is the device stability. Therefore, reviewing the recent research progress on the stability of high‐performance OSCs is urgent and necessary. This review discusses the factors limiting device lifetime, such as metastable morphology, air, irradiation, heat, and mechanical stresses. Additionally, this review presents the research progress over the last 5 years, focusing on enhancing device stability from the perspective of photoactive layers and other functional layers, which includes material design and device engineering, such as solid additives, device fabrication, optimizing buffer layers, using stable electrodes, and encapsulation. Lastly, this review explores current commercialization challenges and prospects, including using advanced machine learning techniques to assist experimental research.
“…Controlling the composition of the amorphous metal can improve the performance. Recently, our group reported that the ternary CuZrTi amorphous metal has excellent elastic deformation limit and structural stability compared to the binary CuZr amorphous metal. − A laminate structure in which two materials are repeatedly stacked may highlight the advantages of each material. So, the two types of layers can interact complementarily in terms of mechanical and electrical properties. − …”
Nanolaminate with alternating layers of nanocrystalline Cu and amorphous CuZrTi is suggested as highly stretchable and conductive interconnect material in stretchable devices. 50 nm nanocrystalline Cu and 20 nm amorphous CuZrTi are the optimum thicknesses of the constituent layers, which result in an elastic deformation limit of 3.33% similar to that of the monolithic amorphous CuZrTi film and an electrical conductivity of 11.83 S/μm corresponding to 70% of that of the monolithic nanocrystalline Cu film. The enhanced elastic deformability and conductivity of the nanolaminates enable the maintenance of the interconnect performance for cyclic stretching with a tensile strain of 114% in the form of a free-standing serpentine structure and a tensile strain of 30% in the form of an ordinary circular coil on an elastomer substrate.
“…In recent years, significant efforts have been made to improve the folding resistance of PI films, with a focus on enhancing the thermal stability and modulus of the material. − However, these efforts have been largely limited to increasing intermolecular forces and have not involved actual folding resistance tests. Bea et al and Ahn et al have independently demonstrated the impressive folding resistance of PI/silica hybrids cross-linked with silane end-groups and PI films cross-linked through hydrogen bonds and coordination-based supramolecular networks, respectively. , These PI films have undergone 200000 folding/unfolding tests at a folding radius of 3 mm with promising results.…”
With the trend toward lighter and
thinner flexible electronics,
developing foldable polymeric substrates that can withstand ultralow
folding radiuses has become an urgent issue. Here, a strategy to develop
polyimide (PI) films with excellent dynamic and static folding resistance
under an ultralarge curvature through copolymerizing one “unidirectional
diamine” with classic PMDA-ODA PIs to achieve a kind of folding-chain
PI (FPI). It was theoretically and experimentally confirmed that the
spring-like folding structure equipped PI films with an enhanced elastic
behavior and thus an excellent ability to endure a large curvature.
Among them, FPI-20 did not show any crease even after folding over
200000 times under a folding radius of 0.5 mm, while creases were
observed on pure PI film only after folding 1000 times. It is noteworthy
that the folding radius was almost 5 times smaller than that in current
reports (2–3 mm). Meanwhile, the spread angle of FPI-20 films
after static folding at 80 °C under a 0.5 mm folding radius get
51% larger than that of films, showing the remarkable static folding
resistance.
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