Highly efficient thermal conductivity of polydimethylsiloxane composites via introducing “Line-Plane”-like hetero-structured fillers

et al. 2022

Macro Materials & Eng

Cyanate resins are high‐performance thermosetting resins with excellent mechanical, thermal, and dielectric properties. In this work, a novel cyanate ester monomer, 3,9‐bis‐(4‐cyanato‐phenyl)‐2,4,8,10‐tetraoxa‐spiro[5.5]undecane structure (DBCE), is prepared based on a diphenol (DB) with a degradable diacetal structure. The characterization of the chemical structures and polymerization behaviors of the samples are achieved by nuclear magnetic resonance spectroscopy, fourier transform infrared spectroscopy, and differential scanning calorimetry. The obtained results confirm the successful syntheses of DB and DBCE, and the polymerization temperature of DBCE is between 160 °C to 250 °C, which is lower than that of a comparative commercial cyanate ester resin (BADCy). The thermal and dielectric properties of the curedresin (Poly‐DBCE) are explored by dynamic mechanical analysis, thermogravimetric analysis, and an Agilent impedance analyzer. The results reveal that Poly‐DBCE manifest promising heat resistance (Tg = 294 °C) and thermal stability (Td,5 = 347 °C and char yield at 800 °C = 37.6%). The dielectric constant and dielectric loss of the Poly‐DBCE at 10 MHz are 3.11 and 0.0095, respectively. Additionally, the Poly‐DBCE is completely degraded under mildly acidic conditions, and efficient recoveries of carbon fiber and glass fiber with high values are reported from their corresponding fiber‐reinforced composites.

Section: Thermal Propertiesmentioning

confidence: 74%

Section: Resultsmentioning

confidence: 99%

Cyanate Ester Resin with High Heat‐Resistance and Degradable Diacetal Structure: Synthesis, Polymerization, and Properties

Liu

Xia

et al. 2022

Macro Materials & Eng

“…Similarly, the initial ( T d initial ), 5% ( T d5% ), and the maximum ( T dmax ) weight loss temperatures of BFs and Ni–Fe–P-coated BFs in Figure d show a gradually increasing trend with the increase of deposition. Among these, the thermal stability of 56.25% Ni–Fe–P-coated BFs is the best, whose T d initial , T d5% , and T dmax increase by 31, 39, and 17 °C, respectively, with a heat resistance of 190.44. − The T d initial , T d5% , and T dmax increase by 13, 18, and 7 °C, respectively, for the plated BFs with a 0.45% deposit amount. All these results are consistent with the conclusion that the higher deposition amount corresponds to better thermal stability.…”

Section: Resultsmentioning

confidence: 99%

Improving the Thermal Stability and Functionality of Bamboo Fibers by Electroless Plating

Zhang

ACS Sustainable Chem. Eng.

Chen

et al. 2022

As environmental stress is caused by using fossilbased plastics, bamboo fibers (BFs), as one of the important natural materials, have received more and more attention. However, their poor thermal stability and lack of functionality largely limit their wider application. In this work, the electroless plating method was used to improve the thermal stability of the BFs and impart this function. It was found that the amount of metal deposition was the main factor affecting the thermal stability of BFs. A critical value existed, above which the surface of BFs could be completely covered by a plating layer, resulting in much enhanced thermal stability. The initial degradation temperature of BFs could be improved by 31 °C, as detected by TG. XRD and TG-FTIR spectroscopy were used to further understand the observed increase in thermal stability induced by electroless plating. It is suggested that the coating layer could block the invasion of external O 2 , thus delaying the degradation time and the pyrolysis rate. It is also very interesting to find that hygroscopicity and electrical and magnetic properties could be simultaneously improved. Our work provides a new method for the modification of BFs, which is important for the application of BFs.

“…Therefore, the industry generally believes that the bottleneck of the future development of electronic products is not the hardware or heat dissipation design, but whether effective heat dissipation materials can be prepared to solve the thermal failure problem in the operation of modern electronic products. Polymers are widely used in electronic packaging, thermally conductive adhesives, and other fields because of their chemical stability, good insulation, and industrial production [ 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 ]. However, most of the polymer materials are poor thermal conductors with low thermal conductivity, generally between 0.1–0.5 W·m −1 ·K − 1 , which greatly limits their wider applications [ 17 , 18 ].…”

Section: Introductionmentioning

confidence: 99%

Development and Perspectives of Thermal Conductive Polymer Composites

Hu²,

Li³

et al. 2022

Nanomaterials

With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.