Highly conductive polymer-decorated Cu electrode films printed on glass substrates with novel precursor-based inks and pastes

Choi, Yun-Hyuk; Lee, Jae-Ho; Kim, Suk Jun; Yeon, Dong-Hee; Byun, Younghun

doi:10.1039/c2jm15124c

Cited by 41 publications

(31 citation statements)

References 35 publications

(38 reference statements)

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“…However, gold and silver present a problem from the viewpoint of reducing costs because they are precious metals. For that reason, the fabrication of copper wiring using a dispersed solution of particles of the base metal copper is being studied [11] [12]. However, since copper oxidizes extremely easily, it is essential to process it in an inert gas, such as the synthesis of the copper particles, the fabrication and handling of their dispersion solution, and the thermal processing necessary for film curing [13] [14].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Copper Wire Using Glyoxylic Acid Copper Complex and Laser Irradiation in Air

Ohishi¹,

Kimura²

2015

MSA

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Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 µm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10 −5 Ω•cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.

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Section: Introductionmentioning

confidence: 99%

Fabrication of Copper Wire Using Glyoxylic Acid Copper Complex and Laser Irradiation in Air

Ohishi¹,

Kimura²

2015

MSA

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“…[8][9][10][11][12] Copper coordination compounds are desirable ink materials as they are inexpensive, easy to prepare and process, compatible with a range of different printing methods and have excellent electrical properties. [13][14][15][16][17][18][19] For instance, copper formates coordinated to alkylamines convert to metallic copper under relatively mild conditions providing metallic traces with resistivity values as low as 5.0 mO cm. 20 Unfortunately, the thermal sintering conditions typically used can cause polyethylene terephthalate (PET) to deform or simply alter its optical transmission thereby limiting their use with these substrates.…”

mentioning

confidence: 99%

Pyridine–copper(ii) formates for the generation of high conductivity copper films at low temperatures

et al. 2016

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“…TGA analysis also indicates that the Cu content of the molecular Cu ink is ∼16%, which agrees well with the theoretical Cu content (17%). It is interesting to note that the decomposition temperature of the Cu MOD ink with DEAPD (110–170 °C) in air and in an inert atmosphere is in a similar range to the Cu formate with alkylamine ligands (110–150 °C) − in an inert atmosphere. However, the decomposition temperature is lower than the Cu formate coordinated with amino alcohols (125–190 °C) , and other amine diols .…”

Section: Resultsmentioning

confidence: 96%

Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces

Deore

Paquet

Kell

et al. 2019

ACS Appl. Mater. Interfaces

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Screen printing is the most common method used for the production of printed electronics. Formulating copper (Cu) inks that yield conductive fine features with oxidation and mechanical robustness on low-temperature substrates will open up opportunities to fabricate cost-effective devices. We have formulated a screen-printable Cu metal-organic decomposition (MOD) ink comprising Cu formate coordinated to 3-(diethylamino)-1,2-propanediol, a fractional amount of Cu nanoparticles (CuNPs), and a binder. This simple formulation enables ∼70–550 μm trace widths with excellent electrical [∼8–15 mΩ/□/mil or 20–38 μΩ·cm] and mechanical properties with submicron-thick traces obtained by intense pulse light (IPL) sintering on Kapton and poly(ethylene terephthalate) (PET) substrates. These traces are mechanically robust to flexing and creasing where less than 10% change in resistance is observed on Kapton and ∼20% change is observed on PET. Solderable Cu traces were obtained only with the combination of the Cu MOD precursor, CuNP, and polymer binder. Both thermally and IPL sintered traces showed shelf stability (<10% change in resistance) of over a month in ambient conditions and 10–70% relative humidity, suitable for day-to-day fabrication. To demonstrate utility, light-emitting diodes (LEDs) were directly soldered to IPL sintered Cu traces in a reflow oven without the need for a precious metal interlayer. The LEDs were functional not only during bending and creasing of the Cu traces but even after 180 min at 140 °C in ambient air without losing illumination intensity. High definition television antennas printed on Kapton and PET were found to perform well in the ultrahigh frequency region. Lastly, single-walled carbon nanotube-based thin-film transistors on a silicon wafer were fabricated with a screen-printed Cu source and drain electrodes, which performed comparably to silver electrodes with mobility values of 12–15 cm2 V−1 s−1 and current on/off ratios of ∼105 and as effective ammonia sensors providing parts per billion-level detection.

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Highly conductive polymer-decorated Cu electrode films printed on glass substrates with novel precursor-based inks and pastes

Cited by 41 publications

References 35 publications

Fabrication of Copper Wire Using Glyoxylic Acid Copper Complex and Laser Irradiation in Air

Fabrication of Copper Wire Using Glyoxylic Acid Copper Complex and Laser Irradiation in Air

Pyridine–copper(ii) formates for the generation of high conductivity copper films at low temperatures

Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces

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