2013
DOI: 10.1016/j.nima.2013.05.006
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High-voltage pixel detectors in commercial CMOS technologies for ATLAS, CLIC and Mu3e experiments

Abstract: a b s t r a c t High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution. In the R/D phase of the development, a radiation tolerance of 10 15 n eq =cm 2 , nearly 100% detection efficiency and a spatial resolution of about 3 μm were demonstrated. Since 2011 the HV detectors have first applications: the technology is presently the main option for the pixel detector of the planned… Show more

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Cited by 60 publications
(43 citation statements)
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“…State-of-the-art silicon pixel detectors can reach very good position resolutions (∼ 3 µm), with a thickness of 50 µm Si + 25 µm Kapton per layer [21], corresponding to ∼ 10 −3 radiation lengths per layer. On the other hand, the complete drift-chamber spectrometers of MEG or MEG-II amount to less than 3 × 10 −3 radiation lengths over the whole track length within the tracking volume, nonetheless material effects gave a significant contribution in MEG and will almost be dominant in MEG-II.…”
Section: Positron Energymentioning
confidence: 99%
“…State-of-the-art silicon pixel detectors can reach very good position resolutions (∼ 3 µm), with a thickness of 50 µm Si + 25 µm Kapton per layer [21], corresponding to ∼ 10 −3 radiation lengths per layer. On the other hand, the complete drift-chamber spectrometers of MEG or MEG-II amount to less than 3 × 10 −3 radiation lengths over the whole track length within the tracking volume, nonetheless material effects gave a significant contribution in MEG and will almost be dominant in MEG-II.…”
Section: Positron Energymentioning
confidence: 99%
“…Hardware assemblies with planar silicon and active HV-CMOS [2] sensors have been tested in the lab and during test-beam campaigns at DESY and CERN using the EUDET/AIDA telescope [3] containing 6 planes of Mimosa26 pixel sensors. Figure 1a shows a picture of the testbeam setup at DESY.…”
Section: Randd On Sensor and Readoutmentioning
confidence: 99%
“…It has 25 µm pixel size, supports power-pulsing and is implemented in 65 nm technology. As a first step, this chip work in progress was glued to a CCPDv3 HV-CMOS sensor [9], creating a capacitive coupling between the two. The assembly was tested at the CERN PS test beam in August 2014 and successfully took data, showing a correlation between recorded hit position and reconstructed track position.…”
Section: Thin Sensor Assembliesmentioning
confidence: 99%