High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

Li, Jianwei; Wang, Xitao; Qiao, Yu; Zhang, Yang; He, Zhanbing; Zhang, Hailong

doi:10.1016/j.scriptamat.2015.07.022

Cited by 144 publications

(44 citation statements)

References 40 publications

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“…The thermal conductivity of 398 W/m•K was obtained for sintered Cu. This result is reasonably consistent with the thermal conductivity value of sintered Cu reported by Davis [38] as well as by Kim et al [40].…”

Section: Density Of Sintered Copper Base Compositessupporting

confidence: 93%

Fabrication, Microstructure, Thermal and Electrical Properties of Copper Heat Sink Composites

Daoush¹,

Swidan²,

El-Aziz³

et al. 2016

MSA

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Copper as well as copper base composites reinforced with coated and uncoated 1 wt% diamond, graphite particles or short carbon fibers are prepared by powder metallurgy process. The reinforcement particles were encapsulated with silver as well as copper layer by using the electroless deposition technique to investigate the influence of the reinforcement surface coating on the microstructure, density, electrical and thermal properties of the sintered samples. The coated and the uncoated powders were cold compacted at 600 MPa, and then sintered at 1173 K (900˚C) for 2 h under hydrogen atmosphere. The phase composition, morphology and microstructure of the prepared powders as well as the copper base sintered composites were investigated using X-ray diffraction analysis (XRD) and Scanning Electron Microscope (SEM) equipped with an Energy Dispersive Spectrometer (EDS) respectively. The density of the sintered composites was measured by Archimedes method. The copper base consolidated composites had a density up to 96% and the reinforcement coated particles were distributed uniformly within the copper matrix better than the uncoated one. The electrical resistivity at room temperature and the heat transfer conduction of the produced samples were measured in a temperature range between 323 K (50˚C) and 393 K (120˚C). The results observed that the sintered materials prepared from the coated powder have lower electrical resistivity than the sintered materials prepared from the mixed powders. On the other hand the thermal conductivity values were calculated using the heat transfer conduction values by means of the Fourier formula. The results observed that the thermal conductivity of copper is (391

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Section: Density Of Sintered Copper Base Compositessupporting

confidence: 93%

Fabrication, Microstructure, Thermal and Electrical Properties of Copper Heat Sink Composites

Daoush¹,

Swidan²,

El-Aziz³

et al. 2016

MSA

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“…We previously showed that chromium (Cr) carbide nanostructures generated in an MWCNT–Cu composite can increase the interfacial bonding strength of MWCNT/Cu without deteriorating the thermal conductivity of the composite 22 . Alloying the metal matrix with elements such as Cr, Zr, and Ti offers a route to improve the interfacial thermal conductivity in the diamond–Cu composite 23 – 26 .…”

Section: Introductionmentioning

confidence: 99%

Chromium carbide/Carbon Nanotube Hybrid Structure Assisted Copper Composites with Low Temperature Coefficient of Resistance

Cho

Kikuchi

Lee

et al. 2017

Sci Rep

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In order to explore the possibility of using carbon nanotube (CNT) to introduce and control the temperature coefficient of resistance (TCR) of metal matrix composite, relatively thick and short multi-walled CNTs (MWCNTs) were introduced in the metal matrix with in-situ formation of chromium carbide (Cr7C3) at the CNT/copper (Cu) interface. We demonstrate that incompatible properties such as electrical conductivity and TCR can be achieved simultaneously by introducing MWCNTs in the Cu matrix, with control of the interfacial resistivity using the MWCNT/Cr7C3–Cu system. High electrical conductivity of 94.66 IACS and low TCR of 1,451 10–6 °C−1 are achieved in the 5 vol.% MWCNT–CuCr composite. In-situ formation of Cr7C3 nanostructures at the MWCNT/Cu interface by reaction of diffused Cr atoms and amorphous carbon of MWCNTs would assist in improving the electrical properties of the MWCNT–CuCr composites.

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“…A similar effect could be achieved by using the carbide-forming elements-coated diamond particles to fabricate copper/diamond composites. Most of the earlier literature's themes on copper/diamond composites are toward the fabrication process of copper/diamond composites with high thermal conductivity value by designing different processing parameters based on materials thermal dynamics principle and collate the TC prediction value by different models to the experimental results [16][17][18][19][20][21]. Some research works characterized the morphology of the interface area and identified phases formed at the interface layer [9,[22][23][24].…”

Section: Introductionmentioning

confidence: 99%

“…Some research works characterized the morphology of the interface area and identified phases formed at the interface layer [9,[22][23][24]. Some of them modified the interface thermal conductance parts in TC models based on the interface characteristics to make the TC prediction value close to the experimental value [19,25,26]. For copper/diamond composites, it still lacks a deep understanding on how the interface characteristics affect heat transfer behavior.…”

Section: Introductionmentioning

confidence: 99%

High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

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High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

Cited by 144 publications

References 40 publications

Fabrication, Microstructure, Thermal and Electrical Properties of Copper Heat Sink Composites

Fabrication, Microstructure, Thermal and Electrical Properties of Copper Heat Sink Composites

Chromium carbide/Carbon Nanotube Hybrid Structure Assisted Copper Composites with Low Temperature Coefficient of Resistance

High thermal conductive copper/diamond composites: state of the art

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