High Thermal Conductivity Nanocomposites Based on Conductive Polyaniline Nanowire Arrays on Boron Nitride

Abstract

With the development of soft electronics, conductive composites are garnering an increasing amount of attention. The electrical conductivity, thermal conductivity, and electrical stability of conductive composites are all very important. In particular, the thermal conductivity of conductive composites is critical to the stability of their conductive properties. However, little is reported on thermal management in conductive systems. Herein, sufficiently hydroxylated boron nitride nanosheets (BN‐OH)@polyaniline (PANI) composite nanosheets with a high thermal conductivity and outstanding conductance stability are reported. PANI nanowire arrays are aligned vertically on BN‐OH. This well‐ordered nanostructure provides the means to form a good conductive and thermally conductive path. Notably, the composite through‐plane thermal conductivity is 2.1 W m−1 K−1(≈1000% that of pure PANI) and that the resistivity of the composite is 1.38 Ω cm. Importantly, the resistivity of the composite remains unchanged after 1 h of work. The results show that this composite has prospective applications for use in soft electronics.

A Concurrent Enhancement of Both In‐Plane and Through‐Plane Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride/Alumina Composites by Constructing a Dense Filler Packing Structure

“…Boron nitride (BN) platelets, which exhibit a planar structure alike graphene/ graphite, have been widely adopted as thermal conductive fillers due to their intrinsically high thermal conductivity, [25][26][27][28] outstanding electrical insulation and thermal stability as well as low dielectric properties. [29][30][31] However, the planar BN platelets tend to align along the flow direction when BN-containing polymer composites are molded using injection molding which is typical of predominant shearing effects along the flow direction, [32] thereby resulting in a great disparity between the in-plane and throughplane thermal conductivity of subsequent moldings. [33] For example, Sun et al reported that the in-plane thermal conductivity of polycarbonate (PC)/BN composites reached as high as 3.09 W mK −1 when the BN platelets are fully aligned along the flow direction whereas the thermal conductivity of randomly dispersed BN-containing counterparts was only 0.96 W mK −1 at 18.5 vol% BN.…”

“…Boron nitride (BN) platelets, which exhibit a planar structure alike graphene/graphite, have been widely adopted as thermal conductive fillers due to their intrinsically high thermal conductivity, [ 25–28 ] outstanding electrical insulation and thermal stability as well as low dielectric properties. [ 29–31 ] However, the planar BN platelets tend to align along the flow direction when BN‐containing polymer composites are molded using injection molding which is typical of predominant shearing effects along the flow direction, [ 32 ] thereby resulting in a great disparity between the in‐plane and through‐plane thermal conductivity of subsequent moldings. [ 33 ] For example, Sun et al.…”

Highly Thermally Conductive Yet Electrically Insulative Polycarbonate Composites with Oriented Hybrid Networks Assisted by High Shear Injection Molding

“…[4,5] The addition of thermal conductive fillers is considered as a feasible and DOI: 10.1002/mame.202100632 effective method to enhance the overall thermal conductivity of targeted polymer matrices. [6] A variety of fillers, including metallic fillers (e.g., copper, [7] silver, [8] and nickel [9] ), carbonaceous fillers (e.g., graphene, [10] graphite, [11] and carbon nanotubes [12] ), and ceramic fillers (e.g., boron nitride, [13] silicon carbide, [14] aluminum nitride [15] ) have been employed to improve the thermal conductivity of both thermoplastics and thermosets.…”

Directly Grown Polystyrene Nanospheres on Graphene Oxide Enable Efficient Thermal Management

“…Polymer-based composites are highly demanded for applications in emerging fields such as in artificial intelligence (AI) technologies, fifth-generation (5G) mobile networks, and portable electronic devices owing to their prominent advantages of remarkable thermal conductivity (TC), outstanding thermal stability, easy processability, etc. , With faster running speed and higher power density of electronic components, the thermal accumulation would be sharply increased during operation, resulting in higher heat dissipation requirements for polymer-based composites. , Therefore, exploration of polymer-based composites with high-efficiency thermal dissipation is of great significance to ensure the working reliability of next-generation modern devices.…”