High-temperature polymers for adhesive and composite applications

Shaw, Stephen J.

doi:10.1179/026708387790329568

Cited by 16 publications

(14 citation statements)

References 10 publications

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“…The production of adhesive bonds from polymers which undergo condensation reactions (e.g. polyimides, polybenzimidazoles, epoxy-phenolics) is complicated by the need to remove the volatile by-product (2)(3)(4). For these types of polymeric adhesives, voids in the bondline are readily formed necessitating the use of venting, very high pressures, and vacuum operations during the curing process.…”

Section: Solid State Bonding Of Aromatic Copolyester Thermosetsmentioning

confidence: 99%

“…polyimides, polybenzimidazoles), but their use is limhe joining of structural members by adhesive T bonding has numerous advantages over other techniques such as welding, soldering, and mechanical fastening. These advantages include: reduced weight, improved fatigue resistance, providing a protective barrier to corrosion, no weakening of the adherend due to the presence of stress raisers such as drilled holes, a more uniform stress distribution through the joint, and the potential for reduced costs ( 1 , 2). By far epoxies are the most widely utilized of the currently available structural adhesives.…”

Section: Introductionmentioning

confidence: 99%

“…However, epoxies are limited in their thermal stability. Even the best epoxy resins begin to degrade at temperatures in excess of 175°C (2,3). Other adhesive systems have been developed for use at elevated temperatures (e.g.…”

Section: Introductionmentioning

confidence: 99%

“…* To whom correspondence should be addressed ited because of their high cost, difficult cure cycles, high moisture absorption, and the evolution of volatiles during curing (2)(3)(4)(5).…”

Section: Introductionmentioning

confidence: 99%

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Aromatic copolyester thermosets: High temperature adhesive properties

Frich

Economy

Goranov³

1997

Polymer Engineering & Sci

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The adhesive properties of a new family of crosslinkable aromatic copolyester resins are described in this paper. A unique method for forming an adhesive bond in the solid state through high temperature interchain transesterification reactions (ITR) between cured thin films of these copolyester thermosets is indicated. Bonds formed via this procedure yield average lap shear strengths of roughly 13 MPa to titanium adherends and invariably exhibit failure at the polymer‐metal interface and not within the polymer. Various procedures to increase the strength of the bond at the interface between the polymer and the metal were tested such as the effect of surface pretreatments, primers, fillers, and the role of bondline thickness on the lap shear strength of the joints. Of these, the use of surface pretreatments and thinner bondlines has the greatest effect, raising the observed average lap shear strength of the joints to 16.5 and 20.7 Mpa, respectively. Some of the adhesive properties pertaining to the use of this new thermoset as a matrix in a graphite fiber composite are also presented.

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Section: Solid State Bonding Of Aromatic Copolyester Thermosetsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

“…* To whom correspondence should be addressed ited because of their high cost, difficult cure cycles, high moisture absorption, and the evolution of volatiles during curing (2)(3)(4)(5).…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Aromatic copolyester thermosets: High temperature adhesive properties

Frich

Economy

Goranov³

1997

Polymer Engineering & Sci

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“…Therefore, the realization of epoxy-like processability is a major challenge for the development of new, more versatile high-temperature adhesives. 2 In addition, many of the materials used as high-temperature thermosets suffer from inherent performance limitations in load-bearing applications because they are extremely brittle. For these types of materials to find wide commercial applicability, their toughness must be improved via a method that does not simultaneously sacrifice their high-temperature performance.…”

Section: Introductionmentioning

confidence: 99%

Properties and toughening of heat‐resistant thermosets based on unsaturated ester resins

Canelas

Abbey

Fentress

2002

J of Applied Polymer Sci

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ABSTRACT:We describe our investigations of the curing chemistry and properties of heat-resistant thermosets comprised of unsaturated ester resins. We suggest a mechanism for the rearrangement of the cured matrix and volatile evolution during the curing process. We employed dielectric spectroscopy (DES) as a tool for monitoring the extent of cure, determining glass-transition temperatures, and evaluating electrical properties of the resins. We compare and contrast results obtained by DES to results obtained by dynamic mechanical analysis (DMA). Fracture testing showed that improvements were made in the toughness of these materials by blending the uncured resin with impact modifiers such as hydrocarbon or silicone reactive rubber adducts or poly(arylene ether sulfone)-based thermoplastic oligomers. We determined the effects of the thermoplastic toughening additive's molecular weight, concentration, and endgroup functionality on the phase separation, thermal stability, and fracture toughness of the blend.

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Preparation and characterization of maleimide‐terminated poly(arylene ether sulfone) oligomers of various molecular weights

Jin

Yee

1991

J of Applied Polymer Sci

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A new variation in the bismaleimide (BMI ) resin family, maleimide-terminated poly (oxy-1,4-phenylene sulfonyl-1,4-phenylene) oligomers, has been synthesized. The preparation of oligomers ( n = 1-12) is described in this study. The structure of these oligomers is characterized by FT-IR and NMR spectroscopy. These oligomers are light yellow to light gray powders that can be melted or dissolved in solvents. Their terminating group bismaleimide has relatively high reactivity. Therefore, these BMI resins can be cured a t 250°C to form a crosslinked product. Since the backbone chain is poly (arylene ether sulfone) , the cured polymers have high T i s , which increased from 220°C to higher than 340°C as the number of repeating units n of the corresponding oligomers decreases.

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High-temperature polymers for adhesive and composite applications

Cited by 16 publications

References 10 publications

Aromatic copolyester thermosets: High temperature adhesive properties

Aromatic copolyester thermosets: High temperature adhesive properties

Properties and toughening of heat‐resistant thermosets based on unsaturated ester resins

Preparation and characterization of maleimide‐terminated poly(arylene ether sulfone) oligomers of various molecular weights

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