High-Temperature Polymer Dielectrics For Capacitive Energy-Storage Applications

Venkatasubramanian, Nalini; Wiacek, Kevin; Fries-Carr, S.; Fossum, Eric R.; Dang, Thuy D.

doi:10.1163/ej.9789067644549.i-425.82

Cited by 5 publications

(8 citation statements)

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“…The incorporation of a diamond-like hydrocarbon unit in the fluorenyl polyester backbone (7,8) (FDAPE) is expected to enhance its insulation resistance and film dielectric strength based on the rationale that the HOMO-LUMO band gaps in diamondoids are molecular counterparts of a large fundamental band gap in diamond itself [9].…”

Section: Resultsmentioning

confidence: 99%

“…The synthesis and characterization of the cardo-type polyester FDAPE has also been reported in earlier AFRL studies [7,8]. The glass transition temperatures were determined by Differential Scanning Calorimetry (DSC) for the powder samples and by DMA (Dynamic Mechanical Analyzer) and TMA (Thermal Mechanical Analyzer) for the polymer films.…”

Section: Experimental (A) Synthesis and General Characterization Of Tmentioning

confidence: 99%

“…The candidate high temperature polymers evaluated in this program are based on fluorinated polybenzoxazoles [6] as well as cardotype (fluorenyl) polyesters incorporating diamond-like hydrocarbon structural units [7,8] in the polymer backbone. The chemical structures of the polymer dielectrics examined in this study are shown below in Figure 1.…”

Section: Introductionmentioning

confidence: 99%

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High Performance Polymer Film Dielectrics for Air Force Wide-Temperature Power Electronics Applications (Preprint)

Venkatasubramanian¹,

McNier²,

Tsao³

et al. 2009

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The public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense, Washington Headquarters Services, Directorate for Information SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES) 10. SPONSORING/MONITORING AGENCY ACRONYM(S)Air Force Government is joint author of the work and has the right to use, modify, reproduce, release, perform, display, or disclose the work. ABSTRACTAir Force currently has a strong need for the development of compact capacitors which are mechanically robust and thermally stable for operation in a variety of aerospace power conditioning applications. These applications demand better reliability and flexibility in the power system design as well as decreased thermal load for electronic system cooling. While power conditioning capacitors typically use polycarbonate (PC) dielectric films in wound capacitors for operation from -55 ºC to 125 ºC, future power electronic systems would require the use of polymer dielectrics that can reliably operate at elevated temperatures up to or even exceeding 350 ºC.The focus of this research is the generation and dielectric evaluation, up to 350 ºC, of metallized free-standing thin films derived from high temperature polymer systems such as fluorinated polybenzoxazoles (6F-PBO) and fluorenyl polyesters incorporating diamond-like hydrocarbon units (FDAPE). The discussion will be centered mainly on variable temperature dielectric measurements of film capacitance, dissipation factor and insulation resistance, and the effects of thermal cycling on film dielectric performance. Initial studies clearly point to the dielectric stability of these films for high temperature power conditioning applications, as indicated by relatively minor variations (~ 2 %) in measured film capacitance over the entire range of temperatures studied. Comparison will also be made with the reported variable temperature dielectric properties of the state-of-the-art high temperature FPE films. SUBJECT TERMS ABSTRACTAir Force currently has a strong need for the development of compact capacitors which are mechanically robust and thermally stable for operation in a variety of aerospace power conditioning applications. These applications demand better reliability and flexibility in the power system design as well as decreased thermal load for electronic system cooling. While power conditioning capacitors typically use polycarbonate (PC) dielectric films in wound capacitors for operation from -55ºC to 125ºC, future power electronic systems would require the use of polymer dielectrics that can reliably operate at elevated temperatures up to or even exceeding 350ºC.The focus of this research is the gene...

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Section: Resultsmentioning

confidence: 99%

Section: Experimental (A) Synthesis and General Characterization Of Tmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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High Performance Polymer Film Dielectrics for Air Force Wide-Temperature Power Electronics Applications (Preprint)

Venkatasubramanian¹,

McNier²,

Tsao³

et al. 2009

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“…It has been reported that adding microfiller has a negative effect on dielectric breakdown strength [1] due to the enhancement of the electric field around the aggregated filler particles, leading to decreased breakdown strength. To overcome these limitations, nanocomposite was used as an alternative to replace conventional composite [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15]. Adding a nanoparticle to the polymer matrix resulted in a decrease in the internal electric field due to the reduction in particle size [16].…”

Section: Introductionmentioning

confidence: 99%

Correlation between Structure and Dielectric Breakdown in LDPE/HDPE/Clay Nanocomposites

2014

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Cross-linked polyethylene (XLPE) is commonly used in medium/high voltage insulation due to its excellent dielectric properties and acceptable thermomechanical properties. To improve both electrical and thermal properties to a point that would possibly avoid the need for crosslinking, nanoclay fillers can be added to polymer matrix to form nanocomposites materials. In this paper, PE/clay nanocomposites were processed by mixing a commercially available premixed polyethylene/O-MMT masterbatch into a polyethylene blend matrix containing 80 wt% low density polyethylene LDPE and 20 wt% high density polyethylene HDPE with and without compatibilizer using a corotating twin-screw extruder. Various characterization techniques were employed in this paper, including optical microscopy, AFM, TEM, TGA, DMTA, and dielectric breakdown measurements in order to understand the correlation between structure and short-term dielectric breakdown strength.

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“…Besides, they are also amenable to large area processing into films at a relatively lower cost. An added advantage of a metallized polymer film capacitor design is its 'self-healing' or 'clearing' capability [2,3] that facilitates a graceful failure mechanism which is generally not the case with pure ceramic capacitors.…”

Section: Introductionmentioning

confidence: 99%

High temperature polymer film dielectrics for aerospace power conditioning capacitor applications

Venkatasubramanian

Dang

Bai

et al. 2010

Materials Science and Engineering: B

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High-Temperature Polymer Dielectrics For Capacitive Energy-Storage Applications

Cited by 5 publications

References 0 publications

High Performance Polymer Film Dielectrics for Air Force Wide-Temperature Power Electronics Applications (Preprint)

High Performance Polymer Film Dielectrics for Air Force Wide-Temperature Power Electronics Applications (Preprint)

Correlation between Structure and Dielectric Breakdown in LDPE/HDPE/Clay Nanocomposites

High temperature polymer film dielectrics for aerospace power conditioning capacitor applications

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