High-Temperature Plastics

Precopio, Frank M.; Cohen, Merrill; Zavist, Algerd F.

doi:10.1016/b978-1-4831-9657-2.50007-3

Cited by 2 publications

(2 citation statements)

References 116 publications

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“…The potting properties are used especially in the encapsulation of integrated circuits, hybrid circuits, various modules, sensors, optical elements, including LEDs, or also for the encapsulation of entire printed circuit boards. It is the encapsulation of sensitive components that can be crucial for the reliability of the device as a whole [4]. And because some electronic components are temperature sensitive, conventional potting materials cured at elevated temperatures cannot be used.…”

Section: Introductionmentioning

confidence: 99%

Effect of MgO nanoparticles on material properties of cold-curing epoxy and polyurethane mixtures

Hornak

Prosr

Trnka

et al. 2021

Applied Physics of Condensed Matter (Apcom 2021)

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Potting compounds are an integral part of a large number of electrical devices, in which play the role of mainly mechanical or photosensitive protection. So-called cold-curing resins are one of the subgroups of potting mixtures. This article focuses on this type of potting compound based on epoxy (EPs) and polyurethane (PUs). In addition to the study of their electrical properties, structural properties are also introduced. The main focus of research is on the incorporation of nanometric magnesium oxide (MgO) in different weight ratios and the study of its effect on the properties of synthesized composites. The electrical properties analyses include the changes in relative permittivity, dielectric losses in the wide frequency range, and volume resistivity estimated at DC conditions. In terms of structural analyses, the effect of MgO incorporation on glass transition temperature changes was studied. From the performed investigations it is evident that the selected basic materials can be partially modified to improve their properties, especially in lower levels of filling, where there is a positive decrease of relative permittivity close to industrial frequency (≈3 % for EP+1MgO; ≈11 % for PU+1MgO). For investigated composites is also evident a trend in the growth of dielectric losses. MgO affects also the volume resistivity and glass transition temperature of EPs-MgO and PUs-MgO composites.

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Section: Introductionmentioning

confidence: 99%

Effect of MgO nanoparticles on material properties of cold-curing epoxy and polyurethane mixtures

Hornak

Prosr

Trnka

et al. 2021

Applied Physics of Condensed Matter (Apcom 2021)

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“…Epoxy resins are one of the most widely used thermosetting plastics in electrotechnical applications [ 1 ], and they are mainly used due to beneficial properties such as their low shrinkage during curing, flexibility, strong adhesion to different substrates, chemical resistance, and excellent electrical insulating properties [ 2 ]. The most common products based on epoxy resins are currently adhesives, laminates, coatings, and sealants [ 3 , 4 ], all of which are widely used in various industries. As far as electrical engineering is concerned, epoxy resins are mainly used as the main wall insulation of rotating machines (mostly glass-fiber reinforced [ 5 ]) or as encapsulating and potting materials in electronics [ 6 ].…”

Section: Introductionmentioning

confidence: 99%

Halloysite Nanotubes as an Additive to Ensure Enhanced Characteristics of Cold-Curing Epoxy Resins under Fire Conditions

2020

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At present, the most commonly used electrical insulating materials, including cold-curing epoxy resins, are well designed for normal operating conditions. However, new generations of materials should also be capable of withstanding extreme emergency conditions, e.g., in case of fire. For this reason, this study presents the possibilities of an improved cold-curing epoxy resin using halloysite nanotubes (HNTs) to increase its operational safety. The positive effect of HNT addition is indicated mainly in terms of the suppression of thermo-oxidation processes, which has been demonstrated by the decreases in the maximum heat flow peaks as well as the specific enthalpy values during the thermal decomposition of the epoxy resin. The observed dielectric parameters of the HNT-added materials differ only slightly from those without a filler, whereas their mechanical properties strongly depend on the amount of dispersed HNTs.

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High-Temperature Plastics

Cited by 2 publications

References 116 publications

Effect of MgO nanoparticles on material properties of cold-curing epoxy and polyurethane mixtures

Effect of MgO nanoparticles on material properties of cold-curing epoxy and polyurethane mixtures

Halloysite Nanotubes as an Additive to Ensure Enhanced Characteristics of Cold-Curing Epoxy Resins under Fire Conditions

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