The interfacial chemistry that developed as a result Al 2 O 3 -scale growth on c-Mi ? c 0 -Ni 3 Al alloys at 1150°C was studied using scanning Auger microscopy after the oxide layer was scratched to spall under ultra-high vacuum. The extent of scale spallation was used to evaluate semi-quantitatively the interfacial strength. The alloys investigated were primarily c 0 in structure, containing 22 at.% Al plus further additions of Pt, Cr and/or Hf. In the case of the binary c ? c 0 alloy, it was found that a sub-monolayer of sulfur segregated at the alloy/scale interface. Platinum reduced and hafnium eliminated sulfur segregation, but chromium enhanced it through Cr-S cosegregation, even on Pt-and Hf-containing alloys. Platinum also segregated slightly at the alloy/scale interface. The interface strength was a strong function of the sulfur content. Beyond the effect of eliminating S segregation, Pt and Hf both showed additional beneficial effects on alumina scale adhesion.