We have fabricated low threading dislocation density (TDD) and crack‐free thick AlN films on trench‐patterned AlN templates for application to deep‐ultraviolet (DUV) light‐emitting diodes (LEDs) by employing an epitaxial lateral overgrowth (ELO) process. Using AlN templates with various stripe structures formed along the <10‐10> direction, We systematically investigated mechanism of void structure formed by the ELO process. It was found that the height of void‐tops was proportional to the groove width and the growth rate ratio of vertical to lateral. And, the height of void‐bottoms was proportional to the parameter defined as the square of groove‐width divided by the groove‐depth. Furthermore, the growth rate ratio of vertical to lateral lowered with increasing growth temperature, and heightened with decreasing V/III ratio (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)