High temperature electronic for future hybrid powertrain application

Renken, Folker; Knorr, R.

doi:10.1109/epe.2005.219769

Cited by 13 publications

(2 citation statements)

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“…As power electronics semiconductor and electronic packaging technology advances, higher allowable junction temperatures will further expand the feasible designs and benefits of direct air-cooled power electronics. Currently, silicon insulated gate bipolar transistors have a maximum allowable junction temperature between 125°C and 150°C [2,3] that may be extended to 175°C in the future [3], while advanced semiconductor technologies such as silicon carbide (SiC) and gallium nitride allow operation above 200°C [4][5][6] and may also improve the inverter efficiency at lower temperatures [5].…”

Section: Introductionmentioning

confidence: 99%

High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report

Waye

2016

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The overall project objective is to develop and apply aircooling technology to improve power electronics thermal management design and influence industry, enhancing system performance to help meet the U.S. Department of Energy (DOE) Advanced Power Electronics and Electric Motors (APEEM) Program power electronics technical targets for weight, volume, cost, and reliability. This overall objective includes the following:

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Section: Introductionmentioning

confidence: 99%

High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report

Waye

2016

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“…For this reason, other components of the electrical drive train, e.g., the traction battery, are already air-cooled. This can significantly increase the flexibility in arranging the converters within the vehicle, helping both, to turn conventional models into HEVs and to develop novel car concepts [23], [24].…”

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confidence: 99%

A 120 °C Ambient Temperature Forced Air-Cooled Normally-off SiC JFET Automotive Inverter System

Wrzecionko

Bortis

Kolar

2014

IEEE Trans. Power Electron.

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The degree of integration of power electronic converters in current hybrid electric vehicles can be increased by mitigation of special requirements of these converters, especially those regarding ambient air and cooling fluid temperature levels. Today, converters have their own cooling circuit or are placed far away from hot spots caused by the internal combustion engine and its peripheral components. In this paper, it is shown, how the use of SiC power semiconductors and active control electronics cooling employing a Peltier cooler can help to build an air-cooled inverter system for 120 • C ambient temperature. First, a detailed analysis shows, how the optimum junction of this high-temperature system can be calculated. Then, the operating temperature ranges of power semiconductors, thermal interface materials, capacitors, and control electronics are investigated, leading to a comprehensive analysis of mechanical concepts for the inverter system in order to show new ways to solve electrical and thermal tradeoffs. In particular, the operation of the signal electronics and the gate driver for power semiconductors with a junction temperature of 250 • C within the specified operating temperature range is ensured by appropriate placement and cooling methods, while taking the electrical requirements for limits on the wiring inductances and symmetry requirements into account. The analysis includes an accurate thermal model of the converter and an optimized active cooling of the signal electronics using a Peltier cooler. Finally, a hardware prototype with discrete power semiconductor devices and thus with a junction temperature limit of 175 • C driving high-speed electrical machines is shown to validate the theoretical considerations in a custom-designed high-temperature test environment.

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Efficiency evaluation of a 55kW soft-switching module based inverter for high temperature hybrid electric vehicle drives application

Sun

Lai

Qian

et al. 2010

2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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High temperature electronic for future hybrid powertrain application

Cited by 13 publications

References 1 publication

High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report

High-Temperature Air-Cooled Power Electronics Thermal Design: Annual Progress Report

A 120 °C Ambient Temperature Forced Air-Cooled Normally-off SiC JFET Automotive Inverter System

Efficiency evaluation of a 55kW soft-switching module based inverter for high temperature hybrid electric vehicle drives application

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